Title:
UNDERLAYER FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/063237
Kind Code:
A1
Abstract:
Provided is an underlayer film-forming composition used when an underlayer film material is applied over a film to be processed of a substrate having the film to be processed, an organic film is formed using a pattern-forming material, and after patterning, the underlayer film and the film to be processed are processed using a composite film obtained by impregnating the organic film with a metal compound as a mask pattern, wherein impregnation of the metal compound is minimized when the organic film is impregnated with the metal compound. The underlayer film-forming composition is used to form a composite film mask pattern obtained by impregnating a patterned organic film with a metal compound on a semiconductor substrate, and the composition includes a polymer containing a hydroxy group, and imparts an underlayer film containing 22 mass% or less of a carbonyl group.
Inventors:
MIZUNO JUN (JP)
KAWAI YOHEI ALARIC (JP)
NISHITA TOKIO (JP)
ENDO YUKI (JP)
KISHIOKA TAKAHIRO (JP)
KAWAI YOHEI ALARIC (JP)
NISHITA TOKIO (JP)
ENDO YUKI (JP)
KISHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2022/037545
Publication Date:
April 20, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
UNIV WASEDA (JP)
NISSAN CHEMICAL CORP (JP)
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; G03F7/40; H01L21/027
Foreign References:
| JP2019053228A | 2019-04-04 | |||
| JP2021051107A | 2021-04-01 | |||
| JP2021051108A | 2021-04-01 | |||
| JP2020056889A | 2020-04-09 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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