Title:
UNLOCKING MECHANISM FOR SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/037523
Kind Code:
A1
Abstract:
Disclosed in the present application are an unlocking mechanism for a semiconductor processing apparatus and a semiconductor processing apparatus. The unlocking mechanism is used for opening or closing a lock body structure on a sealing door of a chip storage box, and comprises a key and a driving device, wherein the key can move into or out of a key groove of the lock body structure, and matches the key groove in an inserted manner; the driving device is connected to the key and is used for driving the key, when the sealing door is in a closed state, to rotate from an initial position to a first preset position which can enable the sealing door to be in an openable state, and driving the key, when the sealing door is in the openable state, to rotate from the first preset position to a second preset position which can enable the sealing door to be in the closed state; and the driving device is further used for driving the key to rotate from the second preset position to the initial position after the driving device drives the key to rotate from the first preset position to the second preset position, and the key does not make contact with the key groove at the initial position. The above solution can solve the problem that a wafer is easily contaminated during the unlocking process.
Inventors:
SUN JINBO (CN)
Application Number:
PCT/CN2021/112751
Publication Date:
February 24, 2022
Filing Date:
August 16, 2021
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01L21/673; E05B47/00
Foreign References:
| CN111968934A | 2020-11-20 | |||
| CN202788238U | 2013-03-13 | |||
| CN109969593A | 2019-07-05 | |||
| CN1478046A | 2004-02-25 | |||
| CN109979866A | 2019-07-05 | |||
| US20040040884A1 | 2004-03-04 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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