UPSETTING METHOD AND UPSETTING DEVICE

Title:

UPSETTING METHOD AND UPSETTING DEVICE

Document Type and Number:

WIPO Patent Application WO/2006/080504

Kind Code:

A1

Abstract:

A upsetting method and an upsetting device capable of efficiently increasing the diameter of a bar-like material at at least two positions. In the method, a plurality of guides (31) and (32) having insertion holes (34) are prepared, and the bar-like material (1) fixed to a fixed die (20) is inserted into the insertion holes (34) of the plurality of guides (31) and (32) in order and held therein. Next, while the material (1) is axially pressed by a punch (50R), the plurality of guides (31) and (32) are integrally moved in a direction opposite to the moving direction of the punch (50R) in a mutually fitted state to increase the diameter of the first exposed part (4) of the material (1) exposed between the first guide (31) disposed on the forefront among the plurality of guides (31) and (32) and the fixed die (20). After the first guide (31) is moved, the second guide (32) disposed on the rear side of the first guide (31) among the plurality of guides (31) and (32) is moved in the direction opposite to the moving direction of the punch (50R) to increase the diameter of the second exposed part of the material (1) exposed between the both guides (31) and (32).

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Inventors:

OTAKI ATSUSHI (JP)

Application Number:

PCT/JP2006/301474

Publication Date:

August 03, 2006

Filing Date:

January 30, 2006

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)
OTAKI ATSUSHI (JP)

International Classes:

B21J5/08; B21K1/10

Foreign References:

JP2003290862A	2003-10-14
JPS55126340A	1980-09-30
JP2004261857A	2004-09-24
JPH05237584A	1993-09-17
JP2003053470A	2003-02-26
JP2002096121A	2002-04-02
JPH09253782A	1997-09-30

Other References: