Title:
VAPOR DEPOSITION DEVICE, DEVICE FOR CONTROLLING VAPOR DEPOSITION DEVICE, METHOD FOR CONTROLLING VAPOR DEPOSITION DEVICE, AND METHOD FOR USING VAPOR DEPOSITION DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/041558
Kind Code:
A1
Abstract:
A vapor deposition device (10) has a first processing container (100) and a second
processing container (200). A spout (110) incorporated in the first processing
container (100) and a vapor deposition source (21 incorporated in the second
processing container (200) are interconnected through a connection tube (220).
To the first processing container (100) is connected a gas discharge mechanism
for drawing vacuum inside the container to a desired degree. Organic molecules
vaporized by the vapor deposition source (210) are spouted from the spout (110)
and adhered on a substrate (G) to form a thin film on the substrate (G). Because
the second processing container (200) and the first processing container (100)
are provided as separate bodies from each other, the inside of the first processing
container (100) is not released to the atmosphere, which increases gas discharge
efficiency.
Inventors:
SUDOU KENJI (JP)
Application Number:
PCT/JP2007/068567
Publication Date:
April 10, 2008
Filing Date:
September 25, 2007
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SUDOU KENJI (JP)
SUDOU KENJI (JP)
International Classes:
C23C14/24; H01L51/50; H05B33/10
Foreign References:
| JP2005281808A | 2005-10-13 | |||
| JP2005330537A | 2005-12-02 | |||
| JP2006152326A | 2006-06-15 | |||
| JP2005336527A | 2005-12-08 | |||
| JP2006059640A | 2006-03-02 |
Attorney, Agent or Firm:
KAMEYA, Yoshiaki (Daiichi Tomizawa Building3-1-3, Yotsuya, Shinjuku-ku, Tokyo 04, JP)
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