Title:
VEHICULAR MODULAR DESIGN MULTIPLE APPLICATION RECTIFIER ASSEMBLY HAVING OUTER LEAD INTEGUMENT
Document Type and Number:
WIPO Patent Application WO/2002/069396
Kind Code:
A2
Abstract:
A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has a plurality of identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes such that plates are selectively negative or positive depending on the plurality of diodes mounted within the plate. A lead integument formed from an insulator material is mounted on a heat sink plate opposing the other heat sink plate and has embedded conductors and connectors that interconnect diode electrodes and other rectifier components.
Inventors:
DENARDIS NICHOLAS
Application Number:
PCT/US2002/004950
Publication Date:
September 06, 2002
Filing Date:
February 20, 2002
Export Citation:
Assignee:
TRANSPO ELECTRONICS INC (US)
International Classes:
H01L25/11; H02K11/04; H02M7/00; B60R16/02; B60R16/03; (IPC1-7): H01L23/00
Foreign References:
| DE3930158A1 | 1991-03-21 | |||
| EP0822642A1 | 1998-02-04 | |||
| US6198188B1 | 2001-03-06 | |||
| US5043614A | 1991-08-27 |
Attorney, Agent or Firm:
Warther, Richard K. (Dyer Doppelt, Milbrath & Gilchris, P.A. 255 South Orange Avenue Suite 1401 P.O.
Box 3791 Orlando FL, US)
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Claims:
THAT WHICH IS CLAIMED IS :
| 1. | A rectifier assembly comprising: two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation, each heat sink plate having a plurality of identically positioned diode mounting holes; a plurality of rectifier diodes mounted within said diode mounting holes, each diode having a diode electrode, wherein one plate is selectively negative or positive dependent on the polarity of diodes mounted within the plate such that one heat sink plate is negative and the other heat sink plate is positive, said diode electrodes extending in a common direction, wherein diode mounting holes not receiving diodes therein are adapted to provide diode electrode clearance and ventilation; and a lead integument formed from an insulator material and mounted on a heat sink plate opposing the other heat sink plate having embedded conductors and connectors that interconnect diode electrodes and other rectifier components. |
| 2. | A rectifier assembly according to Claim 1, and further comprising a plurality of standoffs formed of an insulator material and mounted between the two heat sink plates for separating the two plates. |
| 3. | A rectifier assembly according to Claim 2, wherein the standoffs are mounted by snap fit connection into a heat sink plate. |
| 4. | A rectifier assembly according to Claim 1, wherein the heat sink plates are substantially semicircular configured and adapted to be mounted within an automotive generator. |
| 5. | A rectifier assembly according to Claim 1, and further comprising a plurality of diode mounting positions on the lead integument for receiving field excitation diodes that interconnect lead integument connectors and diodes. |
| 6. | A rectifier assembly according to Claim 5, wherein said diode mounting positions further comprises diode mounting clips that receive a diode in a snap fit connection. |
| 7. | A rectifier assembly according to Claim 1, and further comprising a threaded output terminal mounted on a heat sink plate and extending through the lead integument. |
| 8. | A rectifier assembly according to Claim 1, and further comprising component attachment positions formed on said heat sink plates for receiving one of a side connector, stud terminal and/or spade terminal. |
| 9. | A rectifier assembly according to Claim 8, wherein the one of a side connector, stud terminal and/or spade terminal and component attachment positions are configured for snap fit connections. |
| 10. | A rectifier assembly comprising: two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation, each heat sink plate having a plurality of identically positioned diode mounting holes; a plurality of rectifier diodes mounted within said diode mounting holes, each diode having a diode electrode, wherein one plate is selectively negative or positive dependent on the polarity of diodes mounted within the plate such that one heat sink plate is negative and the other heat sink plate is positive, said diode electrodes extending in a common direction such that negative diode electrodes extend toward the heat sink plate having positive diodes and extend through diode mounting holes not receiving diodes therein for diode electrode clearance and ventilation; and a lead integument formed from an insulator material and mounted on the heat sink having the positive diodes and having embedded conductors and connectors that interconnect diode electrodes and other rectifier components. |
| 11. | A rectifier assembly according to Claim 10, and further comprising a plurality of standoffs formed of an insulator material and mounted between the two heat sink plates for separating the two plates. |
| 12. | A rectifier assembly according to Claim 11, wherein the standoffs are mounted by snap fit connection into a heat sink plate. |
| 13. | A rectifier assembly according to Claim 10, wherein the heat sink plates are substantially semicircular configured and adapted to be mounted within an automotive generator. |
| 14. | A rectifier assembly according to Claim 10, and further comprising a plurality of diode mounting positioned on the lead integument for receiving field excitation diodes that interconnect lead integument connectors and diodes. |
| 15. | A rectifier assembly according to Claim 14, wherein said diode mounting positions further comprises diode mounting clips that receive a diode in a snap fit connection. |
| 16. | A rectifier assembly according to Claim 10, and further comprising a threaded output terminal mounted on the heat sink plate having the positive diodes and extending through the lead integument. |
| 17. | A rectifier assembly according to Claim 10, and further comprising component attachment positions formed on said heat sink plates for receiving one of a side connector; stud terminal and/or spade terminal. |
| 18. | A rectifier assembly according to Claim 17, wherein the one of a side connector, stud terminal and/or spade terminal and component attachment positions are configured for snap fit connections. |