Title:
VEHICULAR MODULAR DESIGN MULTIPLE APPLICATION RECTIFIER ASSEMBLY HAVING OUTER LEAD INTEGUMENT
Document Type and Number:
WIPO Patent Application WO2002069396
Kind Code:
A3
Abstract:
A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has a plurality of identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes such that plates are selectively negative or positive depending on the plurality of diodes mounted within the plate. A lead integument formed from an insulator material is mounted on a heat sink plate opposing the other heat sink plate and has embedded conductors and connectors that interconnect diode electrodes and other rectifier components.
Inventors:
DENARDIS NICHOLAS
Application Number:
PCT/US2002/004950
Publication Date:
March 27, 2003
Filing Date:
February 20, 2002
Export Citation:
Assignee:
TRANSPO ELECTRONICS INC (US)
International Classes:
H01L25/11; H02K11/04; H02M7/00; B60R16/02; B60R16/03; (IPC1-7): H02K11/02; H01L25/11; H02K11/04; H02K19/36
Foreign References:
| DE3930158A1 | 1991-03-21 | |||
| EP0822642A1 | 1998-02-04 | |||
| US6198188B1 | 2001-03-06 | |||
| US5043614A | 1991-08-27 |
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