Title:
VIA FILL SUBSTRATE, PRODUCTION METHOD THEREFOR, AND PRECURSOR THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/051816
Kind Code:
A1
Abstract:
The present invention relates to a method for producing a via fill substrate, said method including: a metal film formation step in which a metal film is formed, said metal film comprising an active metal on a hole wall surface of an insulating substrate that comprises a hole; a filling step in which a conductor paste having a volume change rate of -10% to 20% before and after firing is used to fill the hole formed in the metal film; and a firing step in which the insulating substrate that has been filled with the conductor paste is fired.
Inventors:
MAMEZAKI OSAMU (JP)
HAYASHI YOKO (JP)
HAYASHI YOKO (JP)
Application Number:
PCT/JP2016/077805
Publication Date:
March 30, 2017
Filing Date:
September 21, 2016
Export Citation:
Assignee:
MITSUBOSHI BELTING LTD (JP)
International Classes:
H05K3/40; H05K1/11
Foreign References:
| JP2004327508A | 2004-11-18 | |||
| JP2011077177A | 2011-04-14 | |||
| JP2009059744A | 2009-03-19 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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