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Title:
VIBRATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2024/040494
Kind Code:
A1
Abstract:
The present utility model provides a vibration sensor, comprising a circuit board having an accommodating cavity, and a first vibration assembly having a first vibration cavity and a second vibration assembly having a second vibration cavity which are respectively arranged on two opposite sides of the circuit board. The circuit board is provided with a first through hole for communicating the first vibration cavity with the accommodating cavity and a second through hole for communicating the second vibration cavity with the accommodating cavity; the first vibration assembly vibrates so that the air pressure in the first vibration cavity changes and the vibration is transferred to a MEMS chip through the first through hole, and the second vibration assembly vibrates so that the air pressure in the second vibration cavity changes and the vibration is transferred to the MEMS chip through the second through hole. The MEMS chip in the vibration sensor provided by the present utility model can better sense vibrations generated by the two vibration assemblies, and convert sensed vibration signals into electric signals, thereby effectively improving the sensitivity and greatly improving the signal-to-noise ratio at the same time.

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Inventors:
MENG ZHENKUI (CN)
Application Number:
PCT/CN2022/114686
Publication Date:
February 29, 2024
Filing Date:
August 25, 2022
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04
Domestic Patent References:
WO2022000794A12022-01-06
Foreign References:
CN114630254A2022-06-14
CN211240080U2020-08-11
CN216531784U2022-05-13
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