WAFER DRYING DEVICE AND DRYING METHOD

WIPO Patent Application WO/2023/230987

A1

Provided in the embodiments of the present disclosure are a wafer drying device and drying method. The wafer drying device comprises: a rotating work platform, which bears a wafer from a support side of the wafer, and drives the wafer to rotate around a first axis; a spraying component, which is movably arranged on a side to be dried of the wafer that is opposite the support side, and is spaced apart from same by a first predetermined distance in an axial direction, so as to spray a solvent beneficial for drying onto the side to be dried; and a heating component, which is movably arranged on the side to be dried of the wafer, and is spaced apart from same by a second predetermined distance in the axial direction, wherein the heating component comprises a plurality of heating zones with adjustable heating power, so that different regions of the side to be dried can be respectively heated in a controllable manner. The wafer drying device directly heats and dries a wafer from the front, such that the heating efficiency is higher, and the temperature can be controlled more precisely. By using such a heating component, fewer optical radiation units are used, thereby improving reliability.

XU ZHENHUA (CN)
WANG JIANJUN (CN)
LUO CONGDE (CN)
GE XIAOJING (CN)
ZHANG LIANG (CN)
NIU BEN (CN)

PCT/CN2022/096847

December 07, 2023

June 02, 2022

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HUAWEI TECH CO LTD (CN)

H01L21/67

JP2008270402A	2008-11-06
CN112233979A	2021-01-15
CN114388387A	2022-04-22
CN103811383A	2014-05-21
TW201826321A	2018-07-16
US20060086373A1	2006-04-27

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