Title:
WAFER INSPECTION DEVICE AND METHOD FOR DIAGNOSING WAFER INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/173777
Kind Code:
A1
Abstract:
The wafer inspection device according to one embodiment of the present invention has: a tester that applies an electrical signal to a semiconductor device formed on a wafer; a prober that electrically connects the semiconductor device and the tester to each other; a tester control unit that controls the operations of the tester; and a prober control unit that controls the operations of the prober. In the cases of diagnosing the state of the tester, the tester control unit and the prober control unit communicate with each other.
Inventors:
KUREBAYASHI SHINYA (JP)
Application Number:
PCT/JP2018/009012
Publication Date:
September 27, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/66; G01R31/28
Foreign References:
| JP2007235031A | 2007-09-13 | |||
| JPH08179893A | 1996-07-12 | |||
| JPH0150153A | ||||
| JPH10150082A | 1998-06-02 | |||
| JP2007234645A | 2007-09-13 | |||
| JPH0547867A | 1993-02-26 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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