Title:
WAFER PAD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2003052801
Kind Code:
A3
Abstract:
The invention provides a wafer pad assembly and actuation system for use in an ion implanter, preferably a batch-type ion implanter. The wafer pad assembly includes a rotatable wafer support pad having an upper surface for mounting the wafer, and a lower surface rotationally mounted to a housing of the wafer pad assembly. The lower surface of the wafer support pad further comprises a flange connected to a rotatable shaft. The shaft is connected to an actuator for selectively indexing the shaft so that the wafer support pad is rotationally indexed about its geometric center. The lower surface of the wafer support pad is also connected to a frame having an outer curved surface rotatably mounted within a mating bearing surface of a housing. The curved frame is connected to a plurality of linkages for moving the wafer support pad within the curved frame so that the wafer is pivotable or tiltable about its geometric center.
Inventors:
PHARAND MICHEL
WEED ALAN
WEED ALAN
Application Number:
PCT/US2002/040201
Publication Date:
January 29, 2004
Filing Date:
December 17, 2002
Export Citation:
Assignee:
AXCELIS TECH INC (US)
International Classes:
H01L21/683; G21K5/08; H01J37/20; H01J37/317; H01L21/265; H01L21/687; (IPC1-7): H01L21/00; G21K5/08; H01J37/02; H01J37/20; H01J37/317
Foreign References:
| US4733087A | 1988-03-22 | |||
| US4794305A | 1988-12-27 | |||
| US4745287A | 1988-05-17 | |||
| US6329664B1 | 2001-12-11 | |||
| US4733091A | 1988-03-22 | |||
| US5641969A | 1997-06-24 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 09 30 September 1996 (1996-09-30)
PATENT ABSTRACTS OF JAPAN vol. 012, no. 393 (E - 670) 19 October 1988 (1988-10-19)
PATENT ABSTRACTS OF JAPAN vol. 012, no. 393 (E - 670) 19 October 1988 (1988-10-19)
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