Title:
WAFER PROBER CAPABLE OF PREHEATING PROBE CARD BY USING HOT WIND
Document Type and Number:
WIPO Patent Application WO/2019/172537
Kind Code:
A1
Abstract:
The present invention relates to a wafer prober capable of hot wind-based preheating. The wafer prober comprises: a wafer camera connected to an upper plate of the wafer prober and mounted to be able to move to the upper portion of a chuck by means of a moving module; and a hot-wind spraying module fixedly mounted on the upper surface of the wafer camera. The hot-wind spraying module comprises: a heater for heating air introduced through an air injection port and discharging the air; a heater power supply for driving the heater; an air injection module for injecting air into the air injection port of the heater; a hot-wind chamber having a hot-wind injection port formed through one surface thereof and having multiple discharge ports formed through the other surface thereof such that a hot wind discharged from the heater is introduced into the hot-wind injection port and sprayed to the outside through the discharge ports; and a hot-wind injection tube for providing the hot wind discharged from the heater to the hot-wind chamber. Accordingly, the hot-wind spraying module preheats components inside the wafer prober by using the hot wind. The wafer prober according to the present invention is characterized in that a hot-wind spraying module is mounted on a wafer camera for vision inspection, and a probe card and the like can be quickly preheated by using a hot wind.
Inventors:
KANG KUN SU (KR)
Application Number:
PCT/KR2019/001552
Publication Date:
September 12, 2019
Filing Date:
February 08, 2019
Export Citation:
Assignee:
SEMICS INC (KR)
International Classes:
G01R31/28; G01R1/04
Foreign References:
| KR100831990B1 | 2008-05-26 | |||
| KR20180012972A | 2018-02-07 | |||
| KR20100075124A | 2010-07-02 | |||
| KR20100056725A | 2010-05-28 | |||
| JP2010087090A | 2010-04-15 |
Attorney, Agent or Firm:
LEE, Ji-Yeon (KR)
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