Title:
WAFER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/112130
Kind Code:
A1
Abstract:
Provided is a wafer processing device capable of performing wafer processing in a shorter tact time. The wafer processing device 1 is provided with: a chamber 11 including an upper unit 21 and a lower unit 22 opposing the upper unit 21, forming an accommodating space 22c for accommodating a wafer 2, the chamber 11 being used for subjecting the wafer to predetermined processing using a supercritical fluid; an upper heater provided on the upper unit 21 so as to be rotatable about a vertical axis and having a support means provided on a lower surface thereof for supporting the wafer, which is horizontally loaded; an open/close means 12 for opening and closing the chamber 11 by causing at least one of the upper and lower units 21, 22 to be moved in up/down directions; and a rotating means 30 for causing the upper heater to rotate about the vertical axis. The rotating means 30 causes the upper heater to rotate so that a wafer loading direction into the upper heater and a wafer unloading direction from the upper heater form a predetermined angle.
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Inventors:
HIFUMI MASATERU (JP)
KUNISHIGE HIDENORI (JP)
SEKIGUCHI HIROFUMI (JP)
ASHIHARA AKIRA (JP)
HYODO KOSUKE (JP)
KUNISHIGE HIDENORI (JP)
SEKIGUCHI HIROFUMI (JP)
ASHIHARA AKIRA (JP)
HYODO KOSUKE (JP)
Application Number:
PCT/JP2020/044878
Publication Date:
June 10, 2021
Filing Date:
December 02, 2020
Export Citation:
Assignee:
REXXAM CO LTD (JP)
International Classes:
H01L21/304; H01L21/683
Foreign References:
JP2013033962A | 2013-02-14 | |||
JP2017183579A | 2017-10-05 | |||
JP2011009299A | 2011-01-13 | |||
JP2013030502A | 2013-02-07 | |||
JP2013131729A | 2013-07-04 |
Attorney, Agent or Firm:
TANIGAWA, Hidekazu (JP)
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