Title:
WAFER PROCESSING METHOD AND APPARATUS, STORAGE MEDIUM AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/063721
Kind Code:
A1
Abstract:
A wafer processing method and apparatus, a storage medium and an electronic device are disclosed, relating to the field of integrated circuit (IC) manufacturing and wafer stacking. The wafer processing method includes: partitioning a target wafer into one or more pre-divided areas each having one or more dies; determining area ratings for each pre-divided area based on test data of the dies in each pre-divided area; and feeding the area ratings of the pre-divided areas to a trained classification model to determine a classification category of the target wafer; identifying a second wafer having a same classification category as the target wafer; and stacking the target wafer with the second wafer. This method improves the production yield of stacked ICs.
Inventors:
PAN XIAODONG (CN)
Application Number:
PCT/CN2019/108058
Publication Date:
April 02, 2020
Filing Date:
September 26, 2019
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G01N21/88; H01L21/66; G01R31/00; G06T7/00; G06V10/82
Foreign References:
| CN105203941A | 2015-12-30 | |||
| CN103367188A | 2013-10-23 | |||
| CN104008550A | 2014-08-27 | |||
| US20170140524A1 | 2017-05-18 | |||
| JP2001160572A | 2001-06-12 | |||
| CN105990170A | 2016-10-05 | |||
| CN105990171A | 2016-10-05 |
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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