WAFER PROCESSING METHOD

WIPO Patent Application WO/2013/051184

A1

The present invention is a wafer processing method in which a wafer is inserted into and held by a holding hole in a carrier, and the carrier holding the wafer is interposed between an upper plate and a lower plate to simultaneously process both surfaces of the wafer. Before a wafer is processed, the height position of the upper plate is detected using a laser displacement meter whilst the carrier holding the wafer is interposed between the upper plate and the lower plate. When the difference between the detected height position and a reference position exceeds a threshold value, it is determined that the wafer is being held incorrectly, and the orientation of the wafer can be corrected. In this way, an incorrectly orientated wafer can be automatically detected with precision before processing to prevent wafer cracking, and efficiency can be improved without requiring manual verification by the operator.

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KANNO SHINYA (JP)

PCT/JP2012/005474

April 11, 2013

August 30, 2012

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SHINETSU HANDOTAI KK (JP)
KANNO SHINYA (JP)

B24B37/005; H01L21/304

JPS62195446U	1987-12-12
JPH02106269A	1990-04-18
JPH0425371A	1992-01-29
JPH11285969A	1999-10-19
JP2011062776A	2011-03-31
JP2006224233A	2006-08-31
JP2008036802A	2008-02-21
JP2010221348A	2010-10-07
JPH06270054A	1994-09-27
JPH07112365A	1995-05-02

YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)

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