Title:
WAFER REWIRING DOUBLE VERIFICATION STRUCTURE, MANUFACTURING METHOD, AND VERIFICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/213613
Kind Code:
A1
Abstract:
Disclosed in the present invention are a wafer rewiring double verification structure, a manufacturing method, and a verification method. The wafer rewiring double verification structure comprises: a die having a substrate, a plurality of pads, and a passivation layer; a plurality of rewiring modules, a gap portion being formed between every two adjacent rewiring modules; dielectric modules disposed on the rewiring modules and provided with inclined surfaces; and electroplating layers disposed on the inclined surfaces. According to the present invention, functional verification can be performed on different rewiring modules on a same wafer in one process.
Inventors:
HUANG WENJIE (CN)
Application Number:
PCT/CN2021/132278
Publication Date:
October 13, 2022
Filing Date:
November 23, 2021
Export Citation:
Assignee:
CHIPMORE TECH CORPORATION LIMITED (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
International Classes:
H01L23/544; H01L21/768; H01L23/538
Foreign References:
| CN113113388A | 2021-07-13 | |||
| CN108336052A | 2018-07-27 | |||
| JP2001274254A | 2001-10-05 | |||
| CN108766958A | 2018-11-06 | |||
| US20030077529A1 | 2003-04-24 | |||
| JP2001282885A | 2001-10-12 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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