Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WAFER ROD SQUARING SYSTEM AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/142639
Kind Code:
A1
Abstract:
A wafer rod (60) squaring system and method. The wafer rod (60) squaring system comprises: a squaring cavity (10) used for removing edge skins (62) of a wafer rod (60); and a movement platform (30) provided on one side of the squaring cavity (10) in a first direction. The movement platform (30) is provided with a feeding mechanism (40) and an unloading mechanism (50), the feeding mechanism (40) and the unloading mechanism (50) being arranged on two opposite sides of the moving platform (30) in a second direction different from the first direction. When the unloading mechanism (50) collects the edge skins (62) and removes a square rod (61) after the edge skins (62) are removed, the feeding mechanism (40) can feed to the squaring cavity (10) another wafer rod (60) to be squared.

Inventors:
WANG XIAOPENG (CN)
LIANG ZHIHUI (CN)
LI XIZHEN (CN)
GONG YIQIANG (CN)
WANG MENG (CN)
SHI YAN (CN)
YANG SHUSHENG (CN)
ZHAO YANHUI (CN)
CHANG SHUN (CN)
LIN XUELONG (CN)
LI ZHIJIAN (CN)
ZHAO WEI (CN)
WANG GUANGYU (CN)
YIN KUN (CN)
Application Number:
PCT/CN2022/134286
Publication Date:
August 03, 2023
Filing Date:
November 25, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TCL ZHONGHUAN RENEWABLE ENERGY TECH CO LTD (CN)
International Classes:
B28D7/04; B28D5/00; B28D7/00; B28D7/02
Foreign References:
CN216914432U2022-07-08
CN113306030A2021-08-27
CN113306029A2021-08-27
CN108656375A2018-10-16
CN212266284U2021-01-01
JP2013026584A2013-02-04
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
Download PDF: