Title:
WAFER TEMPERATURE ADJUSTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/054668
Kind Code:
A1
Abstract:
A wafer temperature adjusting device (1A) is provided with a temperature adjusting sheet (2A) and a top plate (3). The temperature adjusting sheet (2A) has a plurality of temperature adjusting portions (21). The plurality of temperature adjusting portions (21) are divided from each other via a dividing region (22) in the same plane. Each of the plurality of temperature adjusting portions (21) is independently temperature-adjustable. The top plate (3) has a plate body (31) stacked on the temperature adjusting sheet (2A). A surface of the plate body (31) opposite the temperature adjusting sheet (2A) constitutes a semiconductor wafer mounting surface (31f). The top plate (3) has a heat insulating portion (32). The heat insulating portion (32), when viewed from a stacking direction (Ds) of the temperature adjusting sheet (2A) and the top plate (3), is disposed in a position corresponding to the dividing region (22) in the plate body (31). The heat insulating portion (32) has a thermal conductivity smaller than that of the plate body (31).
Inventors:
KOBAYASHI ATSUSHI (JP)
OMURO WATARU (JP)
OMURO WATARU (JP)
Application Number:
PCT/JP2021/032132
Publication Date:
March 17, 2022
Filing Date:
September 01, 2021
Export Citation:
Assignee:
KELK LTD (JP)
International Classes:
H01L21/3065; H01L21/683
Domestic Patent References:
| WO2017170374A1 | 2017-10-05 |
Foreign References:
| JP2018525808A | 2018-09-06 | |||
| JP2017041628A | 2017-02-23 | |||
| JP2006261541A | 2006-09-28 | |||
| JP2019009424A | 2019-01-17 | |||
| JP2006522452A | 2006-09-28 | |||
| JP2020077810A | 2020-05-21 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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