Title:
WATERPROOF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/129418
Kind Code:
A1
Abstract:
This waterproof electronic device contains an electronic-component structure and a waterproof membrane that is formed on at least the entire surface of the electronic-component structure that is immersed in a refrigerant. The electronic-component structure comprises the following: an electronic component that contains a semiconductor element; a heat-dissipating member that is provided such that heat can be transferred thereto from the electronic component; and insulation that surrounds the electronic component so as to expose one surface of the heat-dissipating member.
Inventors:
TEMMEI HIROYUKI (JP)
AMO MINA (JP)
TSUYUNO NOBUTAKE (JP)
IDE EIICHI (JP)
TOKUYAMA TAKESHI (JP)
SATOH TOSHIYA (JP)
ISHII TOSHIAKI (JP)
NAOE KAZUAKI (JP)
AMO MINA (JP)
TSUYUNO NOBUTAKE (JP)
IDE EIICHI (JP)
TOKUYAMA TAKESHI (JP)
SATOH TOSHIYA (JP)
ISHII TOSHIAKI (JP)
NAOE KAZUAKI (JP)
Application Number:
PCT/JP2015/053124
Publication Date:
September 03, 2015
Filing Date:
February 04, 2015
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L23/473; H01L23/28; H01L23/29; H01L23/31; H01L23/48; H05K7/20
Foreign References:
| JP2004119667A | 2004-04-15 | |||
| JP2008270294A | 2008-11-06 | |||
| JP2009277768A | 2009-11-26 | |||
| JP2005093781A | 2005-04-07 | |||
| JP2012009569A | 2012-01-12 | |||
| JP2003309224A | 2003-10-31 | |||
| JPS6187892A | 1986-05-06 | |||
| JP2003031732A | 2003-01-31 | |||
| JP2014187072A | 2014-10-02 |
Attorney, Agent or Firm:
NAGAI, Fuyuki (JP)
Fuyuki Nagai (JP)
Fuyuki Nagai (JP)
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