Title:
WAVINESS PREDICTION DEVICE, WAVINESS PREDICTION METHOD, PROCESSING METHOD FOR POLISHING TARGET ARTICLE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/127601
Kind Code:
A1
Abstract:
The present invention predicts the occurrence of a waviness anomaly. This waviness prediction device comprises: a data input unit for receiving input of waviness data which is obtained by measuring the waviness of a polishing target surface that has been polished by spinning a polishing pad with a planetary gear mechanism; a feature amount acquisition unit for acquiring a feature amount which includes the number of articles processed with the polishing pad and the torque of the sun gear; and a waviness prediction unit for predicting waviness by inputting the feature amount which has been acquired by the feature amount acquisition unit into a prediction model that has learned the relationship between the feature amount and the waviness data.
Inventors:
HASHIMOTO SHUKI (JP)
TOGO YUSUKE (JP)
NARISAWA MOTOYUKI (JP)
TAKEMOTO SHIMPEI (JP)
OKUNO YOSHISHIGE (JP)
TOGO YUSUKE (JP)
NARISAWA MOTOYUKI (JP)
TAKEMOTO SHIMPEI (JP)
OKUNO YOSHISHIGE (JP)
Application Number:
PCT/JP2022/046888
Publication Date:
July 06, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B24B37/005; B24B1/00; B24B37/08; B24B37/12; B24B37/34; B24B49/03; H01L21/304
Domestic Patent References:
| WO2018074091A1 | 2018-04-26 |
Foreign References:
| JPH0890406A | 1996-04-09 | |||
| JP2019507027W | ||||
| JP2014091190A | 2014-05-19 | |||
| JPH33212624A |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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