Title:
WIRE BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/047896
Kind Code:
A1
Abstract:
This wire bonding device is provided with: a capillary (15), which is driven in the vertical direction by means of a motor (40), and which presses a wire to an electrode; a plate spring (31) wherein a displacement corresponding to a pressing load of the capillary (15) occurs; an angle sensor (52) that detects the displacement of the plate spring (31); and a control unit (60) that adjusts the pressing load of the capillary (15). The control unit (60) presses the plate spring (31) by means of the capillary (15) by applying a current of a predetermined value to the motor (40), detects the displacement of the plate spring (31) by means of the angle sensor (52), and corrects the pressing load of the capillary (15) on the basis of the displacement thus detected. Consequently, the pressing load of the bonding tool can be corrected in succession to a bonding operation with a simple configuration.
Inventors:
SHIOZAWA SHIGERU (JP)
KOMIYA KENTARO (JP)
KOMIYA KENTARO (JP)
Application Number:
PCT/JP2017/032224
Publication Date:
March 15, 2018
Filing Date:
September 07, 2017
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H01L21/607
Foreign References:
| JPH1027818A | 1998-01-27 | |||
| JP2010010510A | 2010-01-14 | |||
| JP2014103286A | 2014-06-05 |
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (JP)
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