Title:
WIRE BONDING AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/115241
Kind Code:
A1
Abstract:
Provided is a bonding wire which contains Ag in a core material and has excellent continuous bonding properties and excellent productivity, while being capable of suppressing discoloration of the surface and damage to a semiconductor element during bonding. A bonding wire which comprises a core material that contains 75% by mass or more of Ag and a discoloration prevention layer (14) that is formed on the outer circumferential surface of the core material. The discoloration prevention layer is formed by applying an aqueous solution, which contains at least one aliphatic organic compound having at least one thiol group and 8-18 carbon atoms and at least one surfactant, over the outer circumferential surface of the core material.
Inventors:
HASEGAWA TSUYOSHI (JP)
KUROSAKI YUJI (JP)
KUROSAKI YUJI (JP)
Application Number:
PCT/JP2015/051316
Publication Date:
August 06, 2015
Filing Date:
January 20, 2015
Export Citation:
Assignee:
TATSUTA DENSEN KK (JP)
International Classes:
H01L21/60
Foreign References:
| JP2012049198A | 2012-03-08 | |||
| JPS5691306A | 1981-07-24 | |||
| JP2013219329A | 2013-10-24 |
Attorney, Agent or Firm:
FUJIOKA, TAKAHIRO (JP)
Takahiro Fujioka (JP)
Takahiro Fujioka (JP)
Download PDF: