Title:
WIRE FIXING METHOD AND WIRE FIXING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/128026
Kind Code:
A1
Abstract:
This wire fixing method is a wire fixing method for fixing a wire to a fixing target member, the wire fixing method including: a holding member installing step for installing a holding member, which holds the wire, on one end in a longitudinal direction of the wire; a closely contacting step for bring the holding member into close contact with a first surface of the fixing target member; and a bonding step in which the fixing target member and the holding member are bonded by irradiating at least one portion of a second surface on the reverse side of the first surface of the fixing target member with a laser beam which has an optical axis twisted with respect to the central axis of the wire and has a beam light flux region that does not pass through the wire and passes through the holding member.
Inventors:
KONDO HARUTAKA (JP)
Application Number:
PCT/JP2017/042091
Publication Date:
July 12, 2018
Filing Date:
November 22, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
B23K26/21; A61B1/005; G02B23/24
Foreign References:
| JP2016034352A | 2016-03-17 | |||
| JPH08146306A | 1996-06-07 | |||
| JPH0810973A | 1996-01-16 | |||
| JPH053852A | 1993-01-14 | |||
| JPH0325399A | 1991-02-04 | |||
| JPH0274231A | 1990-03-14 | |||
| US20130281925A1 | 2013-10-24 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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