Title:
WIRE JOINING STRUCTURE, BONDING WIRE USED IN SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/065036
Kind Code:
A1
Abstract:
In the present invention, the reliability of joining between a bonding wire for which the cost of materials was suppressed and an electrode is maintained over an extended period of time even in a harsh environment while increases in resistivity are suppressed despite joining of the bonding wire and the electrode. This wire joining structure 1 has an aluminum-containing electrode 2, a bonding wire 3, and a ball compression part 6 joined to the electrode 2. The bonding wire 3 has a core material 4 having silver as a main component, and a coating layer 5 having gold as a main component. The bonding wire 3 contains at least one group-15 or -16 element selected from sulfur, tellurium, selenium, arsenic, and antimony. With respect to the entirety of the wire, the gold concentration is 2.0-7.0 mass% inclusive, and the group-15 or -16 element concentration is 4-80 mass ppm inclusive in total. A gold-concentrated joining region in which the gold concentration reaches or exceeds 5.0 at% with respect to the total of aluminum, silver, and gold is present near the joining interface of the electrode 2 and the ball compression part 6.
Inventors:
ANTOKU YUKI (JP)
SAKITA YUSUKE (JP)
KAWANO SHOTA (JP)
HIRAI YUKA (JP)
SAKITA YUSUKE (JP)
KAWANO SHOTA (JP)
HIRAI YUKA (JP)
Application Number:
PCT/JP2020/010119
Publication Date:
April 08, 2021
Filing Date:
March 09, 2020
Export Citation:
Assignee:
TANAKA ELECTRONICS IND (JP)
International Classes:
C22C5/06; H01L21/60
Domestic Patent References:
| WO2017187653A1 | 2017-11-02 |
Foreign References:
| JPS6417436A | 1989-01-20 | |||
| JPS6417437A | 1989-01-20 | |||
| JP2001196411A | 2001-07-19 | |||
| JP2012169374A | 2012-09-06 | |||
| JP2014222725A | 2014-11-27 | |||
| JP2016029691A | 2016-03-03 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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