Title:
WIRE SAW ABNORMALITY DIAGNOSIS DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/013509
Kind Code:
A1
Abstract:
A wire saw (1) abnormality diagnosis device comprises: a diagnostic mode execution unit (51), a data group acquisition unit (52), a deviation information calculation unit (54), and a determination unit (55). The diagnostic mode execution unit (51) respectively executes, before cutting by the wire saw (1), a first diagnostic mode in which a processing roller rotates at a fixed speed, a second diagnostic mode in which a feeding reel rotates at a fixed speed, and a third diagnostic mode in which a winding reel rotates at a fixed speed. The data group acquisition unit (52) acquires first to third data groups for a plurality of data items in each of the first to third diagnostic modes. The deviation information calculation unit (54) calculates deviation information relating to a deviation obtained by comparing the first to third data groups with first to third reference data groups occurring during a normal time. The determination unit (55) determines the presence or absence of an abnormality of the wire saw (1) on the basis of the deviation information. As a result, the operating state before cutting is sufficiently monitored and abnormality diagnosis is performed accurately in the wire saw.
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Inventors:
MURATA REIJI (JP)
AKI MITSURU (JP)
SHIMADA YURI (JP)
KAWATSU TOMOYUKI (JP)
AKI MITSURU (JP)
SHIMADA YURI (JP)
KAWATSU TOMOYUKI (JP)
Application Number:
PCT/JP2022/029034
Publication Date:
February 09, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
KOMATSU NTC LTD (JP)
International Classes:
B24B27/06; B24B49/14; B24B49/16; B28D1/10; B28D5/04; H01L21/304
Domestic Patent References:
WO2012089243A1 | 2012-07-05 |
Foreign References:
JP2011148027A | 2011-08-04 | |||
JP2000190196A | 2000-07-11 | |||
JP2014166656A | 2014-09-11 | |||
JP2011104688A | 2011-06-02 | |||
JP2015203646A | 2015-11-16 | |||
JP2000259222A | 2000-09-22 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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