WIRELESS MODULE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2011/118544

A1

Disclosed is a wireless module wherein a wireless signal connecting section has low insertion loss and high reliability. The wireless module has a first wiring board (1), and a second wiring board (2), which is disposed to face the first surface (1a) of the first wiring board (1). Furthermore, the second wiring board (2) is provided with a through hole (3), which has a conductor formed on the inner wall thereof. On the first surface (1a) and/or the second surface (2a) of the second wiring board (2) facing the first surface, a hollow column (4) composed of a conductor is provided at a position that corresponds to the through hole (3). The height of the hollow column (4) in the axis direction, said hollow column being composed of the conductor (3), is lower than the height of a gap between the first surface (1a) and the second surface (2a). One end surface of the hollow column (4) composed of the conductor is not fixed, and wireless signals pass through the hollow portion of the column.

JPS6462902	MICROWAVE AMPLIFIER
JP4004674	Dielectric loading antenna

SHIBUYA AKINOBU (JP)
OUCHI AKIRA (JP)
MIYATA AKIRA (JP)
MIYAZAKI RYO (JP)
WAKABAYASHI YOSHIAKI (JP)

PCT/JP2011/056689

September 29, 2011

March 15, 2011

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NEC CORP (JP)
SHIBUYA AKINOBU (JP)
OUCHI AKIRA (JP)
MIYATA AKIRA (JP)
MIYAZAKI RYO (JP)
WAKABAYASHI YOSHIAKI (JP)

H01P5/08; H01L23/12; H01P5/107

WO2009017203A1	2009-02-05
WO2010023827A1	2010-03-04

JP2002164465A	2002-06-07
JP2003078310A	2003-03-14

SHIMOSAKA, NAOKI (JP)
Naoki Shimosaka (JP)

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