Title:
WIRELESS POWER RECEIVING CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2020/066086
Kind Code:
A1
Abstract:
This wireless power receiving circuit module (10) is provided with a substrate (21), a substrate (22), electronic components (61, 64, 65), a power receiving coil (31), and a ground conductor pattern (51). The substrate (22) has a different number of layers than the substrate (21), does not overlap the substrate (21) in plan view, and shares a prescribed dielectric layer with the substrate (21). The electronic components (61, 64, 65) are mounted on a first primary surface (211) of the substrate (21). The power receiving coil (31) is formed on the substrate (22). The ground conductor pattern (51) is arranged on a second primary surface (212) of the substrate (21), and overlaps with the electronic components (61, 64, 65).
Inventors:
HOSOTANI TATSUYA (JP)
KAIWA KOYO (JP)
KAIWA KOYO (JP)
Application Number:
PCT/JP2019/015725
Publication Date:
April 02, 2020
Filing Date:
April 11, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01F38/14; H01L23/00; H02J50/10; H02J50/70
Domestic Patent References:
| WO2018012378A1 | 2018-01-18 |
Foreign References:
| JP2017005952A | 2017-01-05 | |||
| JP2018102124A | 2018-06-28 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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