Title:
PLANAR-TYPE WIRELESS POWER-RECEIVING CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2020/066085
Kind Code:
A1
Abstract:
A planar-type wireless power-receiving circuit module (101) is provided with: a planar ground conductor (51); a substrate (21); a power-receiving coil (30); and a magnetic sheet (41). The planar ground conductor (51) has an opening (H) provided at the center thereof. The substrate (21) is disposed on a first major surface (MS51A) of the planar ground conductor (51), and has a plurality of dielectric layers stacked thereon, forming a circuit. The power-receiving coil (30) is connected to the circuit, and is disposed in the opening (H). The magnetic sheet (41) overlaps the power-receiving coil (30) in a plan view of the planar ground conductor (51), constitutes a part of the magnetic path of a magnetic flux linked with the power-receiving coil (30), and is disposed on a first major surface (MS30A) of the power-receiving coil (30).
Inventors:
KAIWA KOYO (JP)
HOSOTANI TATSUYA (JP)
HOSOTANI TATSUYA (JP)
Application Number:
PCT/JP2019/015722
Publication Date:
April 02, 2020
Filing Date:
April 11, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01F38/14; H01L23/00; H02J50/10
Domestic Patent References:
| WO2018012378A1 | 2018-01-18 |
Foreign References:
| JP2017005952A | 2017-01-05 | |||
| JP2018102124A | 2018-06-28 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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