Title:
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BOARD, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/120586
Kind Code:
A1
Abstract:
According to one embodiment of the present disclosure, a wiring board comprises a first insulation layer, a second insulation layer, a first line conductor, and a second line conductor. The first insulation layer has a first upper surface, a first lower surface, and one or more opening parts that open at the first upper surface. The second insulation layer has a second upper surface and a second lower surface, the second upper surface being positioned under the first lower surface. The first line conductor is positioned on the second upper surface. The second line conductor is positioned on the second upper surface at an interval from the first line conductor and extends along the first line conductor. At least one of the first line conductor and the second line conductor is signal wiring. In plan view, the second insulation layer has a first region that includes the first line conductor, the second line conductor, and the region that is positioned between the first line conductor and the second line conductor. In plan view, the opening parts are positioned over the first region.
Inventors:
KAWAZU YOSHIKI (JP)
Application Number:
PCT/JP2022/047139
Publication Date:
June 29, 2023
Filing Date:
December 21, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H01L23/02; H01L23/12; H01P3/08
Domestic Patent References:
| WO2021095620A1 | 2021-05-20 | |||
| WO2012073785A1 | 2012-06-07 | |||
| WO2021049111A1 | 2021-03-18 | |||
| WO2017130731A1 | 2017-08-03 | |||
| WO2022114092A1 | 2022-06-02 |
Foreign References:
| US20080023804A1 | 2008-01-31 | |||
| JP2010154230A | 2010-07-08 | |||
| JP2016115736A | 2016-06-23 |
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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