Title:
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/045721
Kind Code:
A1
Abstract:
Provided are: a wiring board structure wherein, without using a conductive adhesive, electrical connection between a metal foil and a protrusion can be ensured, and connection reliability is not susceptible to degradation due to interlayer peeling and the like; and a method for manufacturing the wiring board. A wiring board (1) is provided with: an insulating layer (2); a lower main surface wiring pattern (4) and an upper main surface wiring pattern (3), which are disposed with the insulating layer (2) therebetween; and an interlayer connecting conductor (5) electrically connected to the lower main surface wiring pattern (4) and the upper main surface wiring pattern (3) by penetrating the insulating layer (2) in the thickness direction. The interlayer connecting conductor (5) is integrally formed with the lower main surface wiring pattern (4), and is bonded to the upper main surface wiring pattern (3) with an intermetallic compound (6) therebetween.
Inventors:
ITO SATOSHI (JP)
MORIYA YOICHI (JP)
KANAMORI TETSUO (JP)
YAGI YUKIHIRO (JP)
YAMAMOTO YUKI (JP)
MORIYA YOICHI (JP)
KANAMORI TETSUO (JP)
YAGI YUKIHIRO (JP)
YAMAMOTO YUKI (JP)
Application Number:
PCT/JP2013/070841
Publication Date:
March 27, 2014
Filing Date:
August 01, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/11; H05K3/40
Domestic Patent References:
| WO2011058978A1 | 2011-05-19 |
Foreign References:
| JPH05283835A | 1993-10-29 | |||
| JP2001007533A | 2001-01-12 | |||
| JPH11186728A | 1999-07-09 | |||
| JP2000068641A | 2000-03-03 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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