WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

Title:

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/074105

Kind Code:

A1

Abstract:

This wiring board is provided with: a substrate which is elastic and includes at least a wiring region; wiring which is positioned in at least the wiring region on a first side of the substrate and which has a bellows-shape section that includes multiple ridges and valleys arranged in a first direction, which is one of the in-plane directions of the first surface of the substrate; and an expansion/contraction control mechanism which controls expansion and contraction of the substrate. The expansion/contraction control mechanism includes at least multiple expansion/contraction control units which are positioned in the wiring region of the substrate and which are aligned in the first direction.

Inventors:

OKIMOTO NAOKO (JP)
OGAWA KENICHI (JP)
SOMEYA TAKAO (JP)

Application Number:

PCT/JP2018/038132

Publication Date:

April 18, 2019

Filing Date:

October 12, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DAINIPPON PRINTING CO LTD (JP)
UNIV TOKYO (JP)

International Classes:

H05K1/02; H01B7/06; H05K1/03

Foreign References:

JP2015198103A	2015-11-09
JP2016004875A	2016-01-12
JP2016040793A	2016-03-24
US8987707B2	2015-03-24
US20140299362A1	2014-10-09
US20040192082A1	2004-09-30
JP2013187308A	2013-09-19
JP2007281406A	2007-10-25

Other References: