Title:
WIRING BODY AND METHOD FOR MAKING WIRING BODY
Document Type and Number:
WIPO Patent Application WO/2012/172937
Kind Code:
A1
Abstract:
Provided is a wiring body (100) in which a flexible printed wiring board (1) having an electronic component (5) mounted therein is positioned on top of a heat-radiating metal structure (15). The wiring body (100) is provided with: a reinforcement copper foil layer (12) which is provided on the rear surface side of the region of the flexible printed wiring board where the electronic component is mounted, and has a thickness of 35 μm or more; and an adhesive layer (16) for adhering the flexible printed wiring board to the metal structure. The bubble fraction in the adhesive layer between the reinforcement copper foil layer and the metal structure is set to be less than the bubble fraction in the adhesive layer in other regions.
Inventors:
AKAHANE YOSHIHIRO (JP)
SAITO HIROHISA (JP)
UENISHI NAOTA (JP)
YAMAMOTO MASAMICHI (JP)
SAITO HIROHISA (JP)
UENISHI NAOTA (JP)
YAMAMOTO MASAMICHI (JP)
Application Number:
PCT/JP2012/063113
Publication Date:
December 20, 2012
Filing Date:
May 23, 2012
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
AKAHANE YOSHIHIRO (JP)
SAITO HIROHISA (JP)
UENISHI NAOTA (JP)
YAMAMOTO MASAMICHI (JP)
AKAHANE YOSHIHIRO (JP)
SAITO HIROHISA (JP)
UENISHI NAOTA (JP)
YAMAMOTO MASAMICHI (JP)
International Classes:
H05K1/02; F21V19/00; H01L33/64
Foreign References:
| JP2001127398A | 2001-05-11 | |||
| JPH1092971A | 1998-04-10 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
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Claims: