Title:
WIRING CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/261178
Kind Code:
A1
Abstract:
Provided is an assembly sheet (X) serving as a wiring circuit board assembly sheet comprising: a base material (10); a wiring pattern (30); and a dummy wiring pattern (40). The base material (10) includes a product region (R1) and a frame region (R2) adjacent to the product region (R1). The wiring pattern (30) is positioned in the product region (R1) on one side in the thickness direction of the base material (10), and includes a first wiring (31) and a second wiring (34) that is thicker than the first wiring (31). The dummy wiring pattern (40) is positioned in the frame region (R2) on the one side in the thickness direction, and includes a first dummy wiring (41) and a second dummy wiring (42) that is thicker than the first dummy wiring (41).
Inventors:
SHIBATA NAOKI (JP)
Application Number:
PCT/JP2021/020758
Publication Date:
December 30, 2021
Filing Date:
May 31, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02; H05K3/00; H05K3/18
Foreign References:
| JP2010147251A | 2010-07-01 | |||
| JP2012038914A | 2012-02-23 | |||
| JP2010067317A | 2010-03-25 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Download PDF:
Previous Patent: POLY(AMIC ACID), POLY(AMIC ACID) SOLUTION, POLYIMIDE, POLYIMIDE FILM, LAYERED PRODUCT, METHOD FOR PR...
Next Patent: CIRCUIT BOARD
Next Patent: CIRCUIT BOARD