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Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/261179
Kind Code:
A1
Abstract:
According to the present invention, a heat dissipating board has: an insulating layer (11) (insulating board); and a metal circuit pattern (20) provided to be in direct contact on the insulating layer (11), wherein the outer contour line of the circuit pattern (20) has a rounded corner section (27) having the shape of an arc having a radius of 0.2-5 mm when viewed in a top plan view.

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Inventors:
TAGASHIRA NOBUO (JP)
Application Number:
PCT/JP2021/020805
Publication Date:
December 30, 2021
Filing Date:
June 01, 2021
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/12; H01L23/36; H05K1/02
Foreign References:
JP2006245436A2006-09-14
JP2016058595A2016-04-21
JP2016082108A2016-05-16
JP2011216619A2011-10-27
JP2020110347A2020-07-27
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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