Title:
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/102416
Kind Code:
A1
Abstract:
A wiring circuit board (X1) of the present invention comprises, in order toward one side in the thickness direction, a metal support board (10), a first metal thin film (21), an insulation layer (22), a second metal thin film (23), and a conductor layer (24). The metal support board (10) is provided with a metal support layer (11) and a surface metal layer (12). The surface metal layer (12) is disposed on a first surface of the metal support layer (11) in the thickness direction and has a higher conductivity than the metal support layer (11). The insulation layer (22) has a through hole (22a). The conductor layer (24) has a via (24B). The via (24B) is disposed in the through hole (22a) and is electrically connected to the metal support board (10).
Inventors:
SHIBATA SHUSAKU (JP)
IKEDA TAKAHIRO (JP)
NIINO TEPPEI (JP)
IKEDA TAKAHIRO (JP)
NIINO TEPPEI (JP)
Application Number:
PCT/JP2021/039762
Publication Date:
May 19, 2022
Filing Date:
October 28, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/05; H05K3/46
Foreign References:
| JPH0258899A | 1990-02-28 | |||
| JPH03133633A | 1991-06-06 | |||
| JP2016045971A | 2016-04-04 | |||
| JP2000309887A | 2000-11-07 | |||
| JP2012222047A | 2012-11-12 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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