Title:
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/210247
Kind Code:
A1
Abstract:
A wiring circuit board according to the present invention is provided with: a core layer that is formed of a magnetic body and has first and second main surfaces, which face opposite directions, and first and second lateral surfaces which connect the first main surface and the second main surface to each other; first to fourth insulating layers that are formed on the first main surface, the second main surface, the first lateral surface and the second lateral surface of the core layer; and a winding wire layer that is arranged on the first, second, third and fourth insulating layers so as to surround the first main surface, the second main surface, the first lateral surface and the second lateral surface of the core layer.
Inventors:
INOUE MASAMI (JP)
YAMAZAKI HIROSHI (JP)
YAMAZAKI HIROSHI (JP)
Application Number:
PCT/JP2023/012680
Publication Date:
November 02, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01F17/00; H01F17/04; H01F41/04; H05K1/02
Domestic Patent References:
| WO2015125620A1 | 2015-08-27 |
Foreign References:
| JP2018046181A | 2018-03-22 | |||
| JP2016009833A | 2016-01-18 | |||
| JP2015138935A | 2015-07-30 |
Attorney, Agent or Firm:
NAKAGAWA, Masahiro et al. (JP)
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