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Patent Searching and Data


Title:
WIRING METHOD AND WIRING DEVICE
Document Type and Number:
WIPO Patent Application WO/2000/069234
Kind Code:
A1
Abstract:
A wiring method wherein a wiring head (2) for guiding a linear conductor (5) is moved three-dimensionally with respect to a substrate (11) to move the wiring head along an adhesive layer (12) on the substrate surface and allow the head to intermittently approach the adhesive layer for point-contacting so that the linear conductor is pasted to the substrate surface. A wiring device for the wiring method, comprising a table (1) for holding a substrate, a wiring head capable of shuttling between an approaching position point-contactable with an adhesion layer and a separated position remotest from the adhesion layer, and a motion mechanism (3) for subjecting the wiring head to a translation motion along the substrate surface under the control of a control unit (4), wherein the linear conductor is wired on the substrate surface while being pasted point-by-point on the substrate surface to thereby form a flat transformer, an antenna coil or a wiring pattern on the substrate.

Inventors:
YAMAGUCHI SHIGEO (JP)
ARAHORI MASAAKI (JP)
YAMAMOTO TOSHIO (JP)
NISHIWAKI TOSHIMITSU (JP)
Application Number:
PCT/JP2000/002880
Publication Date:
November 16, 2000
Filing Date:
May 01, 2000
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
YAMAGUCHI SHIGEO (JP)
ARAHORI MASAAKI (JP)
YAMAMOTO TOSHIO (JP)
NISHIWAKI TOSHIMITSU (JP)
International Classes:
G06K19/077; H01F41/04; H01F41/06; H01L21/48; H01L23/64; H05K3/10; H01F27/28; H05K1/16; (IPC1-7): H05K3/10; H05K3/46; G06K19/077; H01F41/04; B42D15/10
Domestic Patent References:
WO1995026538A11995-10-05
Foreign References:
JPH06120665A1994-04-28
JPH10193851A1998-07-28
Other References:
See also references of EP 1100296A4
Attorney, Agent or Firm:
Nagato, Kanji (Shinbashi 5-chome Minato-ku Tokyo, Shinbashi 5-chome Minato-ku Tokyo, JP)
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