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Patent Searching and Data


Title:
WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2022/014378
Kind Code:
A1
Abstract:
This wiring module 10 is attached to a plurality of power storage elements, and comprises a flexible printed board 60 and a protector 70 that holds the flexible printed board 60, wherein: the flexible printed board 60 includes a base film 62A, a plurality of conductive paths arranged on a surface 42S of the base film 62A, and a connector that has a facing surface 91S facing the surface 42S of the base film 62A and is connected to the plurality of conductive paths 63; the plurality of conductive paths 63 and electrode terminals of the plurality of power storage elements are electrically connected to each other; the connector has a connection part 92A connected to the plurality of conductive paths 63; and at least some of the plurality of conductive paths 63 are routed from the connection part 92A through a space between the surface 42S of the base film 62A and the facing surface 91S of the connector.

Inventors:
FUKUSHIMA NAOKI (JP)
NAKAYAMA OSAMU (JP)
MIYAZAKI KATSUSHI (JP)
MORITA MITSUTOSHI (JP)
Application Number:
PCT/JP2021/025159
Publication Date:
January 20, 2022
Filing Date:
July 02, 2021
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/78; H01M50/209; H01M50/249; H01M50/519; H01M50/569; H05K1/02; H05K1/18
Foreign References:
JP2020013655A2020-01-23
JP2576335Y21998-07-09
JP2013197090A2013-09-30
JP2004186505A2004-07-02
JP2020087665A2020-06-04
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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