FILM DEPOSITION METHOD AND FILM DEPOSITION DEVICE

Title:

FILM DEPOSITION METHOD AND FILM DEPOSITION DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/014379

Kind Code:

A1

Abstract:

This film deposition method includes (A)-(D) below. (A) Preparing a substrate that has a first region having a metal film exposed therein, and a second region having an insulating film exposed therein. (B) Supplying an organic compound to the substrate, said organic compound being represented by chemical formula (1) in the description, and including a triple bond between a carbon atom and a nitrogen atom in a head group, and a double bond or a triple bond between carbon atoms in a chain part. (C) Causing the organic compound to be selectively adsorbed onto the first region of the first region and the second region. (D) Polymerizing the chain parts of units of the organic compound that are adjacent to each other, thereby forming a polymer film in the first region.

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Inventors:

NI ZEYUAN (JP)
KATO TAIKI (JP)

Application Number:

PCT/JP2021/025163

Publication Date:

January 20, 2022

Filing Date:

July 02, 2021

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

H01L21/312

Domestic Patent References:

WO2019060413A1

2019-03-28

Foreign References:

JP2020013994A	2020-01-23
US5976625A	1999-11-02
US20130236657A1	2013-09-12