WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Title:

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Document Type and Number:

WIPO Patent Application WO/2018/155434

Kind Code:

A1

Abstract:

A wiring substrate having: an insulating substrate having a square shape in the planar view, a main surface having a recessed section positioned therein, and another main surface opposite to the main surface; and external electrodes positioned on the other main surface of the insulating substrate. The external electrodes are positioned in series on the peripheral edge of the insulating substrate. In the planar view, the area of the external electrodes positioned in the center of a side of the insulating substrate is greater than the area of external electrodes positioned at the end of a side.

More Like This:

JP3716173	SEMICONDUCTOR DEVICE STORING PACKAGE
JPH06334295	PREPARATION OF MULTILAYER THICK FILM CIRCUIT WITH RESISTANCE EMBEDDED
JP3680839	SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING ELECTRONIC DEVICE

Inventors:

KAWAGOE HIROSHI (JP)

Application Number:

PCT/JP2018/005986

Publication Date:

August 30, 2018

Filing Date:

February 20, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

KYOCERA CORP (JP)

International Classes:

H01L23/12; H01L23/04; H01L23/13; H05K1/02

Domestic Patent References:

WO2006114971A2	2006-11-02
WO2009044737A1	2009-04-09

Foreign References:

JP2016086043A	2016-05-19
JP2005216999A	2005-08-11
JPH07263587A	1995-10-13
JPH0363943U	1991-06-21
JP2005101095A	2005-04-14

Other References: