WIRING SUBSTRATE, ELECTRONIC DEVICE, AND NOISE SHIELDING METHOD

WIPO Patent Application WO/2011/111314

A1

A wiring substrate (100) is provided with: power supply planes (141, 143) which are arranged in a D layer (140) on either side of a gap (147); connection members (182, 183, 184) which electrically connect at least one of the power supply planes (141, 143) and an electronic element (181); a plurality of conductor elements (121) which, by being arranged in a repeating fashion, surround a first region, which includes the connection members (182, 183, 184) and at least part of the gap (147); and ground planes (111, 171) which are arranged in an A layer (110) or a G layer (170), and which extend into a third region or a second region containing a region which faces the first region, and a region which faces the conductor elements (121).

JPS5932149	[Title of the device] Wiring device
JP2006294749	HIGH HEAT DISSIPATION CIRCUIT BOARD AND ITS MANUFACTURING METHOD
JP6376551	A liquid photosensitive resin composition for forming an optical waveguide core, an optical waveguide using the same, and a flexible printed wiring board.

TOYAO HIROSHI (JP)
KUSUMOTO MANABU (JP)
KOBAYASHI NAOKI (JP)
ANDO NORIAKI (JP)

PCT/JP2011/000911

September 15, 2011

February 18, 2011

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NEC CORP (JP)
TOYAO HIROSHI (JP)
KUSUMOTO MANABU (JP)
KOBAYASHI NAOKI (JP)
ANDO NORIAKI (JP)

H05K1/02; H05K3/46

JP2009111132A	2009-05-21
JP2007088102A	2007-04-05
JPH08148800A	1996-06-07
JP2009032907A	2009-02-12

HAYAMI, SHINJI (JP)
Shinji Hayami (JP)

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