Title:
WORKPIECE HANDLING SHEET AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/153745
Kind Code:
A1
Abstract:
This workpiece handling sheet 1 is provided with a substrate 12 and an interface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces 2 and perform interface ablation by irradiation with a laser, wherein the interface ablation layer 11 is characterized by containing a UV absorbing agent. This workpiece handling sheet allows favorably handling even fine workpieces.
Inventors:
FURUNO KENTA (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
YAMAGUCHI SEITARO (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
YAMAGUCHI SEITARO (JP)
Application Number:
PCT/JP2021/045507
Publication Date:
July 21, 2022
Filing Date:
December 10, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J5/00; B23K26/57; C09J7/38; C09J11/06; C09J133/00; C09J201/00; G09F9/00; H01L33/48
Domestic Patent References:
| WO2019207920A1 | 2019-10-31 |
Foreign References:
| JP2020188261A | 2020-11-19 | |||
| JP2010251359A | 2010-11-04 | |||
| JP2014515883A | 2014-07-03 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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