Title:
WORKPIECE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/116506
Kind Code:
A1
Abstract:
This workpiece processing device (1) is configured such that a workpiece is placed on a carrying member (80) when the workpiece (P) is to be transferred by a head (31) to a holding unit (6), and the workpiece and the carrying member can move relative to one another in a separating direction (M1) when the workpiece is to be subjected to a work process by the head after having been transferred to the holding unit.
Inventors:
TERAWAKI YOSHIHIDE (JP)
TERADA HIROHIDE (JP)
TERADA HIROHIDE (JP)
Application Number:
PCT/JP2017/044929
Publication Date:
June 20, 2019
Filing Date:
December 14, 2017
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/04
Domestic Patent References:
WO2017122279A1 | 2017-07-20 |
Foreign References:
JP2017005206A | 2017-01-05 | |||
JP2005197589A | 2005-07-21 | |||
JPH0590789A | 1993-04-09 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
Download PDF:
Previous Patent: ULTRASONIC SEALING METHOD AND ULTRASONIC SEALING DEVICE
Next Patent: ULTRASONIC SEALING METHOD AND ULTRASONIC SEALING DEVICE
Next Patent: ULTRASONIC SEALING METHOD AND ULTRASONIC SEALING DEVICE