Title:
WRITING FEELING IMPROVEMENT FILM WITH PROTECTION FILM
Document Type and Number:
WIPO Patent Application WO/2023/188545
Kind Code:
A1
Abstract:
The present invention provides a writing feeling improvement film with a protection film in which the writing feeling improvement film having a writing feeling improvement film base material layer and a wiring feeling improvement layer and the protection film having an adhesive layer and a protection film base material layer are laminated together so that the writing feeling improvement layer of the writing feeling improvement film and the adhesive layer of the protection film contact each other, characterized in that the ratio (WEM/a) of the maximum height of rolling circle waviness profile (WEM) of the writing feeling improvement layer to the thickness a (μm) of the adhesive layer is 0.01 to 1.00 inclusive. According to the present invention, the writing feeling improvement film with the protection film is provided that does not cause floating or separation thereof during storage, transportation, processing, or the like even if a change in temperature occurs, and that maintains the quality thereof.
Inventors:
NAKANISHI MINAMI (JP)
HOSHINO HIROKI (JP)
HOSHINO HIROKI (JP)
Application Number:
PCT/JP2022/044510
Publication Date:
October 05, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J7/38; G06F3/041
Domestic Patent References:
| WO2018221490A1 | 2018-12-06 | |||
| WO2010029773A1 | 2010-03-18 |
Foreign References:
| JP2006206782A | 2006-08-10 | |||
| JP2016196113A | 2016-11-24 |
Attorney, Agent or Firm:
OHISHI Haruhito et al. (JP)
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