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Title:
WROUGHT COPPER ALLOY, COPPER ALLOY PART, AND PROCESS FOR PRODUCING WROUGHT COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2011/125264
Kind Code:
A1
Abstract:
Provided is a wrought copper alloy which has excellent cuttability and extensibility and is optimal for applications where high strength and/or high electrical conductivity is necessary while alleviating environmental burdens. The wrought copper alloy contains 1.5-7.0 mass% Ni, 0.3-2.3 mass% Si, and 0.02-1.0 mass% S and optionally further contains at least one element selected from a group consisting of Sn, Mn, Co, Zr, Ti, Fe, Cr, Al, P, and Zn in a total amount of 0.05-2.0 mass%, with the remainder comprising Cu and incidental impurities. The wrought copper alloy contains a sulfide dispersed therein which contributes to an improvement in cuttability, the sulfide having an average diameter of 0.1-10 µm and an areal proportion of 0.1-10%. The wrought copper alloy has a tensile strength of 500 MPa or more and an electrical conductivity of 25% IACS or more.

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Inventors:
TAKAHASHI ISAO (JP)
KANEKO HIDEO (JP)
KAMATA CHIZUNA (JP)
YAMAMOTO YOSHIHIRO (JP)
ODA KENSAKU (JP)
KURAHASHI KAZUO (JP)
KOSEKI KAZUHIRO (JP)
Application Number:
PCT/JP2010/073451
Publication Date:
October 13, 2011
Filing Date:
December 24, 2010
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
TAKAHASHI ISAO (JP)
KANEKO HIDEO (JP)
KAMATA CHIZUNA (JP)
YAMAMOTO YOSHIHIRO (JP)
ODA KENSAKU (JP)
KURAHASHI KAZUO (JP)
KOSEKI KAZUHIRO (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; C22F1/00
Domestic Patent References:
WO2007126006A12007-11-08
Foreign References:
JP2008075172A2008-04-03
JP2001240923A2001-09-04
JP2009052097A2009-03-12
JP2006152373A2006-06-15
JPS5066423A1975-06-04
JPS52117244A1977-10-01
JP2001059123A2001-03-06
JP2000336442A2000-12-05
JP2000319737A2000-11-21
JP2004183056A2004-07-02
JP2006152373A2006-06-15
JP2001240923A2001-09-04
JP2008075172A2008-04-03
JPH06212374A1994-08-02
JPH0790520A1995-04-04
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Download PDF:
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Claims:



 
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