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JP2005155755A |
To dispense with a barrel polishing process and form a uniform nitrided film when manufacturing an endless metallic ring used in a continuously variable transmission.A polishing device is composed of an end face polishing device and an i...
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JP2005144599A |
To provide a device capable of properly removing a place polluted by a toxic substance such as dioxins, without generating a large quantity of grinding/polishing/cleaning materials and separation materials polluted by the toxic substance...
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JP2005131746A |
To provide a polishing device of a long pipe inside surface, capable of preventing generation of an unpolished part in a step part of the long pipe inside surface.This polishing device of the long pipe inside surface can freely insert at...
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JP3651626B2 |
To provide extremely excellent surface roughness without damaging a surface of a rolling element by providing the abrasive grain of low hardness, and improve the working efficiency, and to reduce the required working time by generating t...
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JP3649550B2 |
To allow to carry out a good polishing process generating little dam age to a semiconductor wafer, as well as to allow to install a polishing cloth to a polishing drum easily and securely. In this chamfering surface polishing device of a...
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JP2005118909A |
To provide a deburring device capable of highly accurately removing a burr generated in a disk-like work having a kerf on an outer peripheral surface and an end surface.This deburring method removes the burr generated in the kerf of a ge...
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JP2005118772A |
To reduce the length of treatment step and a treatment time by increasing a treatment effect in one treatment stage.A can treatment method is disclosed, wherein at least one of various types of treatments including polishing, roughing, c...
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JP2005103717A |
To provide a polishing tool having a polishing part coping with a workpiece of complicated shape while hardly causing a secondary burr by bending along the shape of a polished object part, and having a large contact area with the polishe...
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JP2005103714A |
To provide a grinding apparatus for grinding a connecting end face of a flange, etc. of a pipe element, which has a simple structure, and by which an operator safely raises the working efficiency.The grinding apparatus A comprises: a bod...
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JP2005081475A |
To provide a rubber sleeve for polishing, uniformly polishing each part by improving the compatibility with a body to be polished having a curved surface.In a rubber-made hollow cylindrical body 17, when air is supplied to the inside the...
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JP3633023B2 |
PURPOSE: To facilitate positioning operations for a rotating drum applying buff polishing by providing a control means executing position control and pressure-contact-force control for both a buff and the head window holes of the rotatin...
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JP2005074555A |
To provide an automatic lifting buff holder manufacturable compactly and economically with excellent operability such as fine adjustment of pressing force while automating contact/separation between a buff and a polished surface in a pol...
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JP3629751B2 |
PURPOSE: To obtain a force detection unit in which pressure contact force can be detected in a plurality of directions intersecting perpendicularly by providing a detecting section interposed between the inner circumferential part of a b...
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JP3627065B2 |
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JP3628318B2 |
To efficiently polish both of a polishing surface with small recesses and a flat polishing surface by a hand-held nonwoven polishing sheet. The nonwoven polishing sheet comprises: fibers sterically and undirectionally collected and joine...
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JP3624265B2 |
PURPOSE: To dispense with a backup roll and polish the side end.face of a strip by integrating and erecting brush rolls on the same inclined axis so that one of the brush rolls corresponds to one half side of a roll and the other corresp...
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JP3624361B2 |
To provide a pressure mechanism capable of making a sanding head for dry sanding the vehicle coated film surface on the side of a work of an automobile body or the like come in contact with the work surface corresponding to its configura...
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JP2005034972A |
To reduce the replacement frequency without causing deterioration in polishing effect even after a long-time use in an insulating sheet layer and a protective sheet formed on the surface of a metal bump forming side of a metal foil in wh...
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JP3619381B2 |
To provide a polishing method capable of efficiently making the inner circumferential end face highly smooth at a low cost by supplying a polishing liquid containing free abrasive grains to the inner circumferential end face of each of d...
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JP2005021995A |
To provide a brush polishing device for a metal ring for applying brush polishing of high accuracy to the metal ring by preventing the bristle ends of a polishing brush from becoming uneven.This brush polishing device provided with the p...
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JP2005022047A |
To provide a mirror finishing method of an end of a recording medium disk original sheet that eliminates a pit of the end of a recording medium substrate within a short period of time, is easily operated, and is performed at a low cost.T...
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JP2005021993A |
To provide a metal ring reversing device of simple structure which positively reverses a metal ring and rapidly reverses even a plurality of metal rings without lowering efficiency.The reversing device 10 for the metal ring W provided be...
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JP3613733B2 |
The present invention provides methods and apparatuses for polishing hard discs, which polish discs evenly, which dispose of frictional electricity between discs and polishing materials, and which prevent the discs from frictionally heat...
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JP3612876B2 |
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JP2005001079A |
To provide method and device for automatically polishing the surface of a sample piece for performing an environment-friendly dry polishing by automating a sample polishing process in a Vickers hardness measurement, etc. of a cold-rolled...
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JP2004358591A |
To provide a polishing tool and a polishing method for uniformly and rapidly polishing a free curved surface such as a nonaxisymmetric aspheric surface while suppressing the occurrence of polishing unevenness.Polishing is performed using...
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JP3605832B2 |
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JP2004537646A |
A method for producing a coating of fluorescent or luminophore material includes the steps of depositing the luminophore material from a vapor phase on a substrate in such a manner that at least 30 weight-% of the luminophore material us...
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JP2004351587A |
To cope with a stubborn stain such as alkali stain or oil stain besides removing uneven stains adhering to a surface of glass, tableware or a tool having a mirror surface, and to effectively remove them in a short period without damaging...
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JP3600773B2 |
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JP3595612B2 |
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JP2004330375A |
To efficiently polish a disk storage medium according to damage of the medium.This device has a plurality of polishing means 111 to 115 for polishing the surface of the disk storage medium 9 and a supporting body 116 for supporting a plu...
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JP3584058B2 |
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JP2004299018A |
To solve the problem that the characteristic required in the device forming on the surface or growth of a single crystal film can not be obtained because the crystal surface is not obtained, in the material where the crystal surface cann...
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JP3572652B2 |
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JP2004268240A |
To provide a method for processing the surfaces of the long articles, without causing the environmental problems and degradation of mechanical properties of the long articles, and capable of meeting an in-line arrangement.This long artic...
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JP2004268249A |
To solve the following problem: the front end of a printed circuit board material have a possibility of breakage when a polished face is curved so as to protrude and the front end of the printed circuit board material, especially an ultr...
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JP2004261900A |
To provide a device for hairline-machining a flat surface and a curved surface of a railway vehicle structure made of an aluminum alloy.The vehicle structure 1 made of the aluminum alloy is formed of a floor structure 2, side structures ...
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JP2004528186A |
Disclosed is a reel-to-reel single-pass mechanical polishing system ( 100 ) suitable for polishing long lengths of metal substrate tape ( 124 ) used in the manufacture of high-temperature superconductor (HTS) coated tape, including multi...
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JP3566417B2 |
A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be m...
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JP3565680B2 |
To obtain a device which can set parallelism of the outer surface of textile roller with the table surface on the rubbing device of liquid crystal substrate correctly and easily. This device is provided with a cylinder 53 of which outer ...
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JP3559809B2 |
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JP3560051B2 |
To permit an equipment space to be approximately a space for a substrate to be processed plus a space for translation movement and provide a compact equipment by constitution which permits a second polishing tool to perform circular tran...
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JP2004241139A |
To provide a cleaning pad that can prevent smearing of discharge electrode at cleaning of a corona discharge device with good yield of manufacture and reduced cost.The cleaning padding, which is constructed of an adhesive layer 2 to be f...
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JP2004525714A |
Cleaning articles comprising a nonwoven web or foam, binder, and organic particles. In another aspect, the present invention provides a method for cleaning soiled surfaces utilizing cleaning articles comprising a nonwoven web or foam, bi...
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JP2004230659A |
To provide a method for finishing a surface of a cylinder capable of finishing an outer peripheral surface of a coated metal layer formed by thermal spraying on an outer peripheral surface of a cylindrical cylinder body by an operation i...
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JP2004230519A |
To provide a grinder capable of grinding/removing stains on pipe inner/outer surfaces of a used plastic pipe.The grinder for the used plastic pipe comprises a grinding chamber 12 storing the used plastic pipe so as to be freely take in/o...
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JP2004235446A |
To provide a polishing pad for polishing a semiconductor wafer wherein generation of scratch is little, lifetime of a polishing layer is superior and polishing rate is stabilized, in a polishing pad which has the polishing layer in which...
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JP2004223684A |
To provide a wafer notch polishing pad capable of suppressing an over-polish phenomenon, and polishing a notch without leaving unmachined part.In the wafer notch polishing pad for polishing the notch 2 of a wafer 1, an outer peripheral p...
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JP2004223696A |
To provide a grinding method capable of conducting removing grinding burrs and polishing a ground surface in succession to grinding of work, and reducing machining cost by eliminating the need of transferring work, a special burr removin...
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