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WO/1999/067054A1 |
A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contac...
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WO/1999/059774A1 |
A machine tool wherein a unit (42) for supplying machining fluid to the machining area of a tool (T) when a work (W) is machined with the tool (T) detachably fitted to the main shaft (12) of the tool is provided with a fluid ejecting por...
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WO/1999/043469A1 |
A multi-pass grinding method for fabricating an endodontic instrument. A tapered rod (10) is sucessively advanced past a rotating grinding wheel (12) to remove layers (14, 16, 18, 20) of material from the rod (10) until attaining a desir...
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WO/1999/039869A1 |
The present invention relates to a method and a device for machining glass-lenses using a glass-lens machining apparatus with computerised numerical control. The method of the present invention comprises the following steps: introducing ...
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WO/1999/023449A1 |
A predicted in-situ reflectivity measurement (ISRM) trace is calculated for a substrate undergoing a chemical mechanical polishing. This predicted ISRM trace is an estimate of the measured reflectivity of the substrate as a function of t...
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WO1999002303A1 |
A dental curet and sharpening machine system has been developed for convenient, accurate, and rapid sharpening of dental curets. Curets comprising a cutting blade, shank, and handle have been designed so that, regardless of the instrumen...
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WO/1998/057778A1 |
A grinding machine for grinding an inner race (38) of a constant velocity joint, which contains a grinding wheel (40) with a concentric peripheral surface of boron nitride, and a device for rotating the grinding wheel at a speed of at le...
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WO/1998/047660A1 |
The invention concerns a device (2) for setting an adapter (11) on a blank (1) to transfer and fix it in a cutting device (3) controlled by cutting data, characterised in that it comprises means acquiring (4, 5, 6, 7, 8, 9) characteristi...
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WO/1998/009771A1 |
A method and apparatus for grinding crankshafts or similar devices in which one of the crankpins of the crankshaft is machined and subsequent to this machine step, the actual dimension of the crankpin is measured. This measured value is ...
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WO/1998/003303A1 |
The time to grind a workpiece can be reduced by selecting a grinding wheel whose width is not substantially greater than wheel strength considerations require, and which may therefore be less than the axial length of the region to be gro...
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WO/1997/040432A1 |
A method is described for grinding a composite workpiece (18) to form a component having concentric (31) and eccentric cylindrical regions (30). The method comprises mounting the workpiece (18) in a computer controlled grinding machine (...
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WO/1997/006922A1 |
A shape control method comprising the steps of applying a voltage between an electrically conductive grindstone (2) and an electrode (4) spaced from the grindstone (2) while allowing a conductive liquid (7) to flow between the grindstone...
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WO/1996/002355A1 |
A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plu...
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WO/1995/034802A1 |
Equipment for the grinding of material samples, for instance the grinding of a rock sample assembled on a microscope slide includes a console and a frame structure (1) with a turntable (3) which is arranged to hold a number of material s...
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WO/1995/003915A1 |
In a machine tool a reference straight-edge is mounted on the worktable of the machine tool and the position of the worktable and therefore the workpiece along the x-axis of the machine is determined by reference to the straight edge; a ...
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WO/1995/003913A1 |
A machining location for machining workpieces, comprising: a machine tool; an enclosure for said machine tool that encloses the entire machine tool within a predetermined space; workpiece storage within said predetermined space for stori...
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WO/1995/003914A1 |
A machine tool comprising: a machine frame; a work carrying assembly for carrying a workpiece, carried by said machine frame for reciprocal movement along a work axis; and a cover assembly carried by said machine frame and including cove...
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WO/1995/003912A1 |
A machine tool comprising a bed, a worktable movable relative to the bed along a linear path and a tool movable to engage a workpiece on the worktable wherein drive means for effecting the movement of the worktable relative to the bed an...
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WO/1995/003916A1 |
A machine tool, comprising: a worktable assembly slidably carried by the machine frame for reciprocal movement along a work axis and which is configured to carry a workpiece. A worktool assembly is slidably carried by said machine frame ...
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WO/1995/003920A1 |
A machine tool, typically a CNC cylindrical grinding machine comprising a bed; a worktable movable relative to the bed along a linear path; a tool head such as a wheelhead movable in a direction generally perpendicular to the direction o...
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WO/1995/003921A1 |
A CNC cylindrical grinding machine comprising a bed, a worktable movable relative to the bed along a linear path, wheelhead movable in a direction generally perpendicular to the direction of worktable travel, a rotatable grinding wheel m...
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WO/1994/029077A1 |
A method of polishing an object is disclosed. In one embodiment, as shown in the figure, the method comprises the steps of creating a polishing zone (10) within a magnetorheological fluid (2); determining the characteristics of the conta...
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WO/1994/002287A1 |
A method for removing a predetermined amount of material from the inner surface (16, 18, 20, 22) of a circular article (10) which deviates from a true circular configuration. The outer surface (32) of the article (10) is touch probed to ...
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WO/1993/025347A1 |
A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plu...
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WO/1992/014580A1 |
A machine for regrinding grooves of a constant velocity universal joint workpiece (91) is disclosed. This machine preferably contains a chuck mechanism (33) for holding the various workpieces of the constant velocity universal joint, an ...
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WO/1988/003452A1 |
An electrical discharge machine uses a graphite electrode (12) to machine a workpiece at a high metal removal rate. When the graphite electrode (12) becomes worn index table (1), which supports the workpiece, uses slide mechanism (4) to ...
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WO/1984/002101A1 |
A centerless grinding system comprises a driven grinding wheel (20), a driven regulating wheel (26), and a work rest blade (25) for centerless grinding of a workpiece supported by the work rest blade between the grinding wheel (20) and t...
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JP7450630B2 |
A method and associated system provides automated abrasive paint repair using automated abrasive paint repair devices that selectively sand, buff, and polish a substrate in response to received instructions generated by a controller. The...
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JP2024022025A |
The present invention provides a technique that can reduce the overall processing time for a plurality of substrates. [Solution] A control device 5 of a substrate processing apparatus performs an arithmetic control process (S210) that ca...
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JP2024014993A |
An object of the present invention is to perform appropriate processing on the substrate before the processing device stopped after a substrate processing device is stopped during operation and then restarted. A processing device that pr...
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JP7423139B2 |
A method and a system are provided for automatically dressing a grinding wheel used to grind workpieces. A workpiece is scanned to determine dimensions of the workpiece. A computer-readable dimensions datafile is generated containing the...
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JP7412996B2 |
A grinding device completes grinding processing of all wafers in a cassette without exchanging a grindstone. The grinding device (1) comprises: a processing condition setting part (91) for setting a processing condition including the var...
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JP7391126B2 |
A processing apparatus includes a holder configured to hold a substrate; a grinding device configured to perform a grinding on a processing surface of the substrate held on the holder; a transfer device configured to transfer the substra...
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JP7323341B2 |
To urge an operator to execute an origin position recognition operation.In a griding device, when an origin position recognition operation is to be executed, an origin position recognition operation start button 51 is made conspicuous by...
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JP2023040571A |
To provide a processing device, which processes a wafer while automatically changing settings of a plurality of processing elements.A processing device 1 comprises: a mechanism 61 that processes a wafer held on a table holding surface 30...
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JP7224265B2 |
A device includes: state information acquisition unit that acquires state information including position of substrate in the device and elapsed time in each unit; action selection unit having prediction model that predicts value, in a ce...
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JP2023019512A |
To provide a processing system selection device and a program capable of immediately proposing an optimal solution for selection of a processing system employed in grinding processing of a processing object.The processing system selectio...
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JP7215312B2 |
A cyber-physical system type machining system comprising: a machine tool equipped with a grinding machine and a control device; and a computer device for generating, in a virtual world, a virtual machining phenomenon corresponding to an ...
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JP7191472B2 |
An objective of the present invention is to omit hardship of replacing a cassette for each type of workpiece to grin different types of workpieces with a grinding device under the same processing condition. A method of using a processing...
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JP7185486B2 |
To prevent a processing device from being left unattended for a long period of time after an error warning has been issued without any operator intervention.A processing device 1 includes holding means 6, processing means 2, control mean...
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JP2022157349A |
To provide a work management system capable of easily managing quality of work aiming at reducing fogging unevenness on a mold surface relative to work including iterative operation for repeatedly moving a work piece by a worker.A work m...
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JP2022527942A |
The present application relates to a system and a method for acquiring real-time polishing data. An exemplary computer implementation method may include receiving sensor data from one or more sensors in a computing device. One or more se...
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JP7069339B2 |
A method for controlling a machine tool-having an operating switch and a lock switch including:activating the operating switch by exerting a force in a direction onto the operating switch for switching over the machine tool from a deacti...
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JP2022059712A |
To provide a processing device capable of preventing information input errors.A processing device 2 that processes a workpiece includes a chuck table 22 that holds a workpiece, a processing unit 26 that processes the workpiece held by th...
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JP7042340B2 |
A processing apparatus includes a holder configured to hold a substrate; a grinding device configured to perform a grinding on a processing surface of the substrate held on the holder; a transfer device configured to transfer the substra...
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JP7004262B2 |
A method and a system are provided for automatically dressing a grinding wheel used to grind workpieces. A workpiece is scanned to determine dimensions of the workpiece. A computer-readable dimensions datafile is generated containing the...
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JP2021186940A |
To display on a display unit a remaining number of workpieces that can be processed with a processing grindstone.A processing device for processing a workpiece includes: a processing unit that processes the workpiece by use of a processi...
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JP6949896B2 |
To select an optimum grinder responsive to a grinding condition independently of a grinding machine. A grinder selection device 30 is a grinder selection device that selects a grinder to be used for grinding machining by a grinding machi...
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JP6943692B2 |
To provide a processing device that can perform both cutting processing and honing processing alone, is small-sized and does not require a complicated structure.The processing device, in which a cutting processing unit 6 having a cutting...
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JP6943691B2 |
To provide a processing device that can perform both cutting processing and honing processing alone, is small-sized and does not require a complicated structure.The processing device, in which a cutting processing unit 6 having a cutting...
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