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WO/2023/040386A1 |
Disclosed are a rework adhesive tape and a peeling method therefor. The rework adhesive tape comprises a base material layer, and a first rework adhesive layer and a second rework adhesive layer attached to two opposite sides of the base...
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WO/2023/042686A1 |
Provided is an adhesive composition capable of forming an adhesive that has a high refractive index, can lower the elastic modulus, and has improved adhesive strength. The adhesive composition includes an acrylic polymer containing an ar...
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WO/2023/042838A1 |
The present invention provides a temporary protective material having both a waterproof property with which it is possible to protect a component mounting surface during a mounting process of a semiconductor substrate, and deformability ...
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WO/2023/042726A1 |
The reinforcing film (10) is equipped with a film base material and an adhesive layer (2) fixedly laminated on one principal surface of the film base material. The adhesive layer is composed of a photocurable composition. The photocurabl...
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WO/2023/042676A1 |
An adhesive sheet (X) serving as a variable-color adhesive sheet of the present invention includes: a base polymer; a chromogenic compound which can reversibly change between a colored state created through a reaction with acid and a non...
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WO/2023/042409A1 |
The purpose of the present invention is to provide an adhesive sheet having an adhesive agent layer that has an adhesive surface having a wettability unlikely to change even when being exposed in an air environment and that is unlikely t...
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WO/2023/042518A1 |
Provided is an optical layered body in which it is possible to suppress a change in reflected hue according to the usage environment thereof. This optical layered body comprises a polarizing plate including a polarizer, and a phase diffe...
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WO/2023/042745A1 |
[Problem] To provide: an organopolysiloxane composition which can undergo a curing reaction, which forms a slightly-adhesive adhesive agent layer having excellent transparency, and from which it is possible to design a heat-curable/light...
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WO/2023/042735A1 |
Provided is a two-pack curable adhesive agent having a rapid PAA reduction rate and excellent storage stability. The two-pack curable adhesive agent comprises: an isocyanate composition (X) which comprises a urethane prepolymer that is...
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WO/2023/042840A1 |
The present invention provides a temporary protective material that has excellent hot water removing properties and has water resistance and adhesion that make it possible to protect a component mounting surface in a step for mounting a ...
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WO/2023/042734A1 |
The present invention provides a urethane prepolymer for a two-component curable adhesive which has a fast PAA decrease rate and excellent storage stability. Provided is a method for producing a urethane prepolymer for a two-component ...
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WO/2023/042789A1 |
Provided are: an adhesive composition which is agingless, has good adhesive properties and excellent storage stability, and can be used reliably for a long time even after the addition of a curing agent; and an adhesive sheet. An adhesiv...
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WO/2023/042744A1 |
[Problem] To provide a curable reactive organopolysiloxane composition that can be made heat curable/light curable, enables design of a composition coatable even at a low solvent content and has sufficient adhesive strength, a cured prod...
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WO/2023/042839A1 |
The present invention provides a temporary protective material which has water resistance and which can protect a component mounting surface, in a semiconductor substrate mounting step. This temporary protective material is used as a pro...
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WO/2023/042811A1 |
Provided are: a method for cleaning a semiconductor substrate by which it is possible to remove (clean), in a shorter time and more cleanly by a simple operation, an adhesive layer obtained by using, for example, a siloxane-based adhesiv...
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WO/2023/039820A1 |
The present application provides an adhesive paper, an electrochemical device comprising said adhesive paper, and an electronic device. The adhesive paper comprises a bonding layer, an insulating heat-resistant layer, and an expansion la...
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WO/2023/042813A1 |
Provided are: a method for cleaning a semiconductor substrate having an adhesive layer on the surface thereof, in which removal (cleaning) can be performed in a shorter period of time and more thoroughly via a simple operation; a method ...
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WO/2023/035217A1 |
Embodiments of the present application provide a battery, an electrical device, and a method and apparatus for manufacturing the battery. The battery comprises: battery cells; and a first component, a first surface of the first component...
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WO/2023/037185A1 |
Curable and cured compositions as well as articles that contain the curable or cured compositions are provided. The curable composition comprises (a) a (meth)acrylic-based multiblock copolymer, (b) a random (meth)acylate copolymer compri...
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WO/2023/038147A1 |
Provided is an adhesive sheet that achieves, at a high level, both conformance to three-dimensional geometry during bonding and shape-retention ability during non-bonding and that has excellent flexibility particularly in a low-temperatu...
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WO/2023/035561A1 |
The present invention relates to an anti-birdstrike flexible film and a preparation method therefor and an application thereof. Specifically, disclosed in the present invention is the anti-birdstrike flexible film; the film has excellent...
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WO/2023/038123A1 |
Provided is an adhesive-layer-equipped substrate having a substrate and an adhesive layer disposed on the substrate, wherein: the adhesive layer contains polymer particles (A), an inorganic oxide (B), and a light-shielding agent (D); the...
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WO/2023/038140A1 |
The objective is to provide a pellicle which less likely generates outgas. A pellicle (10) of the present disclosure comprises a pellicle frame (14), a pellicle film (12) supported on one end face of the pellicle frame (14), and an adh...
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WO/2023/037636A1 |
Provided is an adhesive sheet which is suitable for temporarily fixing an electronic component, includes an adhesive layer containing an acrylic adhesive, and has excellent characteristics at a high temperature. An adhesive sheet for t...
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WO/2023/037914A1 |
Provided is an adhesive composition suitable for a heat-peelable adhesive sheet that has sufficiently high peel strength from an adherend, can be peeled easily from the adherend through heating after process completion, and does not cont...
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WO/2023/033176A1 |
The purpose of the present invention is to provide an adhesive tape for semiconductor device manufacturing, which is excellent in chip component delamination performance, and which is capable of preventing adhesive residue from remaining...
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WO/2023/032790A1 |
Provided is an adhesive sheet that has excellent flexibility at low temperatures and also has excellent resilience. According to the present invention, an adhesive sheet is formed from an adhesive composition [I] that contains an acryl...
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WO/2023/033089A1 |
The present invention provides a cover member suited to preventing damage to a semiconductor element package caused by an increase in internal pressure. The provided cover member comprises: a cover sheet having a shape that covers a targ...
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WO/2023/032685A1 |
The present invention provides an antireflection film with a pressure-sensitive adhesive sheet, the antireflection film being suitable for use in organic EL display devices (OLEDs). This antireflection film 10 with a pressure-sensitive a...
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WO/2023/032796A1 |
The present invention provides an optical laminate including an adhesive sheet and an optical film, the optical laminate being suitable for use in an organic EL display device (OLED). The provided optical laminate includes an adhesive sh...
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WO/2023/032795A1 |
The present invention provides an adhesive composition suited for use in an organic EL display device (OLED). The provided adhesive composition (I) includes a (meth)acrylic polymer (A) as a principal component thereof, and also includes ...
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WO/2023/032135A1 |
The purpose of the present invention is to provide a heat-removable pressure-sensitive adhesive tape which is suitable for use in high-temperature heating steps and, when heated at a higher temperature after use in a heating step, can be...
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WO/2023/028628A1 |
The invention relates to an adhesive element (1) comprising a carrier substrate (2) and an adhesive layer (3) arranged on the carrier substrate (2). According to the invention, the adhesive element (1) comprises at least one recycled mat...
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WO/2023/028222A1 |
Thermoplastic films are disclosed that are suitable for use as paint protection films. The films include a thermoplastic polymer layer comprising a thermoplastic polyurethane polymer and a polyvinyl acetal polymer. The films further comp...
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WO/2023/027092A1 |
Provided is a laminate that is capable of satisfying both ability to follow complicated profiles and ability to tolerate strain. Provided is a laminate comprising: a core body; a first pressure-sensitive adhesive sheet that contains a pr...
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WO/2023/028216A1 |
Thermoplastic polyurethane compositions are disclosed, comprising: a thermoplastic polyurethane polymer or polymer blend comprising the reaction product of: an aliphatic diisocyanate, an aliphatic polyol, and a chain extending agent, whe...
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WO/2023/028200A1 |
Thermoplastic films are disclosed that are suitable for use as auto wraps. The films include a thermoplastic polymer layer comprising a thermoplastic polyurethane polymer and a polyvinyl acetal polymer. The films further comprise a patte...
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WO/2023/027145A1 |
A cell culture chip including a layered body having a flow passage structure inside thereof, in which members respectively constituting layers in the layered body are bonded to each other with an adhesive layer, and the adhesive layer in...
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WO/2023/024267A1 |
The present invention provides a bridging agent, a composition, a masterbatch, a packaging film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1 xR2 y[CH3SiO]n, wher...
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WO/2023/026584A1 |
A film-like adhesive agent comprising an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), wherein the contained amount of the epoxy resin curing agent (B) in the film-like adhesive agent is 0.30-12.0 mass%, the ...
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WO/2023/028202A1 |
Thermoplastic films are disclosed that are suitable for use as auto wraps. The films comprise a thermoplastic polymer layer comprising: a thermoplastic polyurethane polymer; a polyvinyl acetal polymer; and a polymeric plasticizer. The th...
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WO/2023/027091A1 |
The present invention provides a multilayer body which is capable of having both repulsion resistance and distortion resistance at the same time. The present invention provides a multilayer body which is provided with: a core body; a fir...
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WO/2023/028220A1 |
Thermoplastic films are disclosed that are suitable for use as auto wraps. The films include a thermoplastic polyurethane layer comprising a thermoplastic polyurethane polymer and a patterned adhesive layer. The thermoplastic films, when...
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WO/2023/026687A1 |
Provided are: an adhesive composition that has a low resistance and excellent reworkability, and can inhibit the occurrence of dents; and a polarizing plate using the adhesive composition. The adhesive composition according to an embodim...
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WO/2023/022368A1 |
Disclosed is a method for manufacturing an antibacterial film having antibacterial, antiviral, and deodorizing effects according to various embodiments of the present invention to achieve the above-described subject. The method may compr...
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WO/2023/022076A1 |
The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the ...
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WO/2023/021463A1 |
An adhesive film includes a single adhesive layer. The single adhesive layer includes an acrylic polymer and an ultraviolet light absorber capable of absorbing in a wavelength range between 320 nanometers and 390 nanometers. The single a...
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WO/2023/022029A1 |
The purpose of the present invention is to provide an adhesive layer-attached polarizing film having a separator, whereby both easy peelability of the separator and high temperature durability of the adhesive layer are achieved. In the...
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WO/2023/022166A1 |
An adhesive resin composition comprising: 60-95 parts by mass of an ethylene-based polymer (A) including a modified ethylene-based polymer (a-2) obtained by modifying, by an unsaturated carboxylic acid and/or a derivative thereof, at lea...
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WO/2023/021975A1 |
A composition for forming pressure-sensitive adhesives which comprises a monofunctional (meth)acryl monomer having a poly(lactic acid) structure, a polyfunctional (meth)acryl monomer having a poly(lactic acid) structure, and a non-functi...
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