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WO/2023/048168A1 |
The present invention provides a resist composition which contains a base material component (A) and a compound (D0) that is represented by general formula (d0). In the formula, Rd0 represents a fused ring group wherein an aromatic ring ...
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WO/2023/048128A1 |
This resist composition contains a base material component (A), and a compound (B0) represented by general formula (b0). In the formula, Rb0 is a fused ring group in which an aromatic ring and an alicyclic ring are fused. The alicyclic r...
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WO/2023/048298A1 |
Provided is a friction material composition for forming a friction material for a vehicle braking device equipped with a regenerative brake. The friction material composition has a copper content of 5% by mass or less in terms of copper ...
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WO/2023/048002A1 |
Provided is a reducing particle dispersion that achieves a high level of both preservative performance and oxygen reduction performance (oxygen absorbing ability), exhibits said performance in a continual manner (sustained-release) witho...
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WO/2023/048021A1 |
Provided are: a resist underlayer film-forming composition which has excellent embedding and flattening properties for stepped substrates, excellent storage stability, a low film-curing start temperature and a small amount of sublimate g...
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WO/2023/042510A1 |
This fluorine-containing elastomer composition is obtained by blending 0.2-0.9 parts by weight of quinacridone and 0.2-5 parts by weight of a bis-amidoxime compound or 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoro propane, with respect to 1...
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WO/2023/042524A1 |
This sealant material composition comprises (A) a rubber component, (B) a plasticizer, and (C) a crosslinking component. When a 1.2 mm-thick specimen comprising the sealant material composition is set on a parallel plate having a diamete...
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WO/2023/042385A1 |
Linear abrasive members (10A, 10B) are used as abrasive members for a polishing brush. The linear abrasive members (10A, 10B) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed there...
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WO/2023/042696A1 |
According to the present invention, a cured coating having exceptional water and oil repellency and abrasion resistance as well as exceptional chucking properties can be formed by using a fluoropolyether-group-containing polymer having a...
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WO/2023/042384A1 |
Linear abrasive members (10) are used as abrasive members for a polishing brush. The linear abrasive members (10) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed therein. The inor...
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WO/2023/038001A1 |
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...
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WO/2023/038035A1 |
A sealing resin composition comprising an epoxy resin and a curing agent, wherein the curing agent contains an active ester compound and a phenolic compound having a hydroxyl equivalent of 150 g/eq or more.
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WO/2023/038003A1 |
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...
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WO/2023/032926A1 |
The purpose of the present invention is to provide: a laminate having improved synovial properties, wear resistance, stain resistance, liquid repellency, snow/ice sliding properties, droplet sliding properties, corrosion resistance, dura...
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WO/2023/028819A1 |
A silicone release coating dispersion has a polyorganosiloxane continuous phase and an aqueous discontinuous phase. The aqueous discontinuous phase includes water and an ionic liquid. The polyorganosiloxane continuous phase includes a hy...
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WO/2023/029564A1 |
Disclosed in the present application are a carbon/magnetic electromagnetic wave absorbing material having a sandwich structure and a preparation method therefor. an iron salt is utilized and piece-shaped iron(II, III) oxide is prepared; ...
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WO/2023/032585A1 |
Provided is an aerosol composition for cleaning which is capable of stably ejecting a cleaning ingredient. Also provided is a noncombustible cleaner for components which is capable of stably ejecting a cleaning ingredient. The aerosol co...
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WO/2023/032716A1 |
Provided is a polishing composition which has an excellent ability to eliminate bulging around an HLM, and which can improve polishing rate. The polishing composition comprises abrasive grains, a basic compound, and water. In addition, t...
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WO/2023/032930A1 |
This polishing liquid contains cerium oxide abrasive grains and ammonium salt, and has a pH of at least 9.00. This polishing method uses the polishing liquid to polish a member to be polished that contains copper. This component manufact...
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WO/2023/032027A1 |
Provided is a polishing solution for polishing a resin-containing member of interest, the polishing solution comprising abrasive grains containing cerium oxide and an ether compound having a hydroxy group. Also provided is a polishing me...
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WO/2023/033064A1 |
Provided is a refractive index adjustment agent for adjusting the refractive index of adhesives, wherein this refractive index adjustment agent for adhesives is an organic compound comprising a structure having at least two substituents ...
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WO/2023/032715A1 |
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing a...
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WO/2023/032714A1 |
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound,...
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WO/2023/032745A1 |
Provided are: a novel organopolysiloxane compound represented by general formula (1); a room temperature-curable organopolysiloxane composition which contains said compound and a hydrolyzable organosilane compound having a cycloalkenyl o...
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WO/2023/032817A1 |
The present invention provides a surface treatment agent comprising a fluoropolyether group-containing silane compound having a fluoropolyether group and a silyl group, wherein the Si-bonding group that bonds to a Si atom of the silyl gr...
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WO/2023/032929A1 |
This polishing solution is for polishing a resin-containing polishing target member and contains an ether compound having a hydroxy group, and abrasive grains containing cerium oxide. This polishing method is for polishing a resin-contai...
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WO/2023/032534A1 |
Provided are: an allyl ether compound that yields a cured product excellent in terms of low dielectric properties, high heat resistance, and the like; a resin composition thereof; and a cured product obtained from the resin composition.ã...
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WO/2023/032028A1 |
The present invention provides a polishing solution that contains an ammonium salt and abrasive grains containing cerium oxide, and that has a pH of 9.00 or greater. The present invention provides a polishing method for polishing, using ...
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WO/2023/033146A1 |
The purpose of the present invention is to provide a novel substrate with a film formed thereon, in which a high-density film is formed on at least a part of a metal surface present on a substrate. Provided is a substrate with a film for...
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WO/2023/032928A1 |
Provided is a polishing liquid for polishing a member to be polished, said polishing liquid containing abrasive grains which include a cerium oxide, wherein the member to be polished contains a resin and particles which include a silicon...
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WO/2023/034962A1 |
Articles and methods regarding abrasive articles that include antimicrobial properties and improved abrasive performance and comprise a first fiber element comprising a woven or non-woven material; and a second fiber element comprising m...
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WO/2023/034131A1 |
The present disclosure provides a polishing composition that includes at least one first amine, at least one second amine, and other components such as azoles. The first amine has a low molecular weight, for example 120 g/mol or less. Th...
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WO/2023/026814A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium or molybdenum, while maintaining a stabl...
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WO/2023/027188A1 |
Provided are: a solvent composition that contains monochlorotrifluoropropene and a perfluoroolefin having a boiling point of 30-120°C at normal pressure; a cleaning agent that contains the solvent composition; a cleaning method in which...
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WO/2023/027315A1 |
A detonation synthesis nanodiamond abrasive material has an atomic percentage of oxygen of 0% to 12.5%, and an atomic percentage of carbon of 87.5% to 100% on the surface of nanodiamond, and the nanodiamond is formed by detonation.
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WO/2023/027189A1 |
An azeotropic composition, a pseudoazeotropic composition and a composition which have little adverse effect on the global environment and are unlikely to undergo compositional changes even if subjected to repeated evaporation and conden...
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WO/2023/026752A1 |
This method 1 for manufacturing a seal body comprises: a belt-shaped body formation step provided with a cross-linking agent addition step S1 for adding a cross-linking agent 3 to a compound 2 containing a halogen-group-containing monome...
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WO/2023/027167A1 |
The present disclosure provides a multilayer body for display devices, the multilayer body comprising a polyimide base material and a functional layer that is arranged on one surface of the polyimide base material and contains an ultravi...
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WO/2023/028197A1 |
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, anionic particles dispersed in the liquid carrier, an anionic polymer or surfactant, and a cationic polymer.
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WO/2023/027157A1 |
Provided is an infrared curable ink composition which contains infrared absorbing particles and a thermosetting resin, wherein the infrared absorbing particles contain particles of a composite tungsten oxide that is represented by genera...
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WO/2023/026813A1 |
Provided is a chemical mechanical polishing composition capable of chemically mechanically polishing a ruthenium- or molybdenum-containing semiconductor substrate while maintaining a stable polishing rate and suppressing the corrosion of...
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WO/2023/026876A1 |
The present invention provides a surface treatment agent which contains a fluoropolyether group-containing silane compound and a lower fluoroalkyl alcohol, and in which the contained amount of the lower fluoroalkyl alcohol is 30 parts by...
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WO/2023/026778A1 |
The present invention provides a chemical mechanical polishing composition with which it is possible to suppress ruthenium corrosion and also perform chemical mechanical polishing of a semiconductor substrate containing ruthenium while m...
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WO/2023/026779A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium, while maintaining a stable polishing ra...
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WO/2023/026780A1 |
Provided is a composition for chemical mechanical polishing, with which chemical mechanical polishing can be carried out while suppressing corrosion of ruthenium and maintaining a stable polishing speed for a semiconductor substrate cont...
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WO/2023/026892A1 |
Provided are: a resin composition that can produce a cured article having excellent pattern rectangularity; a cured article obtained by curing the resin composition; a layered body including the cured article; a method for producing a cu...
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WO/2023/022152A1 |
Provided is a lubricant composition containing: a base oil; a first compound having a first reaction site; and a second compound having a second reaction site, wherein one of the first reaction site and the second reaction site is a dien...
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WO/2023/021802A1 |
A compound represented by formula (1) or a tautomer thereof; a composition; a layered product; an optical film; an image-forming material; and a method for producing the compound or tautomer thereof. [In formula (1), R1 to R4 are each a ...
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WO/2023/022148A1 |
The present invention provides: an epoxy composition configured for reduced viscosity, etc., where even when some heat is applied, progression of curing and a subsequent rise in viscosity are not promoted; an adhesive agent containing th...
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WO/2023/022038A1 |
This article is characterized by: comprising a surface treatment layer formed of a surface treatment agent containing a fluorooxyalkylene group-containing polymer that does not contain a carbonyl bond but has a hydrolysable group in the ...
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