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WO/2011/008467A1 |
An anisotropic thermal conductive element that can conduct heat from a thermal source with high efficiency in the thickness direction which maintaining strength and a method of making the element. To achieve the above, an anisotropic the...
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WO/2010/147871A2 |
An inexpensive heat exchanger is disclosed, wherein the heat exchanger is made up of a plurality of plates and each plate has at least one channel defined in the plate. The plates are stacked and bonded together to form a block having co...
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WO/2010/141368A2 |
A honeycomb reactor or heat exchanger (12) includes a honeycomb (20) having a plurality of cells (22, 24) extending in parallel along a common direction from a first end (14) to a second end (16) thereof, with the cells being divided by ...
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WO/2010/141366A2 |
Methods and devices for providing a honeycomb monolith reactors 12 or heat exchangers 12 having improved pressure resistance are disclosed, including the method of (1) providing a honeycomb monolith 20 having a plurality of cells 22, 24 ...
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WO/2010/132302A2 |
A heat exchanger may include a core control assembly movable between compressed and uncompressed positions, and a core. The core may have a plurality of layers with a plurality of passages interleaved therebetween, a portion of the passa...
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WO/2010/090766A1 |
The invention is for an apparatus and method for removal of waste heat from heat-generating components including high-power solid-state analog electronics such as being developed for hybrid-electric vehicles, solid-state digital electron...
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WO/2010/056792A1 |
In one aspect, a cooling device (10) for an LED chip (18) mounted on a heat sink (16) includes an enclosed tube in contact with the heat sink (16). The tube includes a vacuum section (12) having a plurality of cooling fins (22) and a liq...
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WO/2010/042985A1 |
A thermal storage device (1) including an insulated casing (2) surrounding a tank (3) for holding a fluid, the tank having an inlet port (4) and an outlet port (8) with a fluid flow path there between, the inlet port (4) being connectabl...
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WO/2010/037164A1 |
A heat exchange unit (102) for use in a modular heat exchange system including at least one first heat exchanger (104) having a closed circuit for cooling fluid at least one air cooler (112) located upstream of the first heat exchanger, ...
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WO/2010/037165A1 |
A heat exchange system (100) including at least one first heat exchanger having a closed circuit for cooling fluid, a least one fan arrangement (110) operable to cause air to pass through the first heat exchanger, and, at least one air c...
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WO/2010/017091A1 |
A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling cool...
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WO/2010/011687A2 |
Heat exchanger plates (6) for indirect evaporative coolers, of the type having a dry side (9) having low permeability to an evaporative liquid (22) and formed to allow a product fluid (1) to flow over a heat transfer area of its surface,...
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WO/2010/008423A2 |
Systems include one or more medicinal storage containers. For example, an integrally thermally sealed medicinal storage container may include one or more segments of at least one ultra efficient insulation material, the one or more segme...
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WO/2009/132430A1 |
There is described a method for fabricating a modular heat sink, the method comprising: extruding N individual integral heat sink segments using an extrusion process, each one of the N segments corresponding to 1/N of the modular heat si...
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WO/2009/117062A2 |
In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements provided for transferring heat across the ends of the thermoelectric device. A method for...
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WO/2009/085291A1 |
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation with coolant.
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WO/2009/076835A1 |
A cooling package and an assembly method and a disassembly method thereof are provided. The cooling package includes: a main frame (100) with a first end and a second end, a first tank (11) supported by the first end of the main frame (1...
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WO/2009/073165A1 |
A cooling device for an electric component or components, includes a coolant liquid circulation system, a carbon-based heat intake block for transferring heat from said electrical component or components, a top layer on the carbon block ...
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WO/2009/049317A2 |
A direct exchange geothermal heating/cooling system (40) has a self-adjusting expansion valve (1) disposed in a liquid refrigerant transport line (8) and a bypass flow path (2 or 11) to improve efficiency when the system (40) operates in...
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WO/2009/021069A1 |
A conductive adapter for carrying relatively high current from a source to an external circuit without degradation is provided. The adapter includes a conducting member made from a conductive nanostructure -based material and having oppo...
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WO/2009/008836A1 |
A heat transfer device for maintaining a temperature of a device under test with heat generating capability at a prescribed temperature, the heat transfer device comprising an inlet flow-duct; an outlet flow-duct; a conductor block compr...
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WO/2008/153989A1 |
A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the elect...
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WO2008063372B1 |
A fluid-cooled heat sink (1) for electronic components comprises a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet ...
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WO/2008/137727A1 |
The modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection in an outdoor environment, an electrical heating element between the first and t...
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WO/2008/137726A1 |
The grounded modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection, an electrical heating element between the first and the second outer l...
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WO/2008/135321A1 |
This invention relates to a heat exchanger (1) having channels/ducts (3, 3', 4, 4') for the exchange of heat between two fluids, comprising at least one extruded longitudinal central body (2) which at least partly forms the channels/duct...
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WO/2008/112013A1 |
Carbon nanotube (CNT) arrays can be used as a thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance (PSTTR) technique, the thermal conductance of the two interfaces on either side of the CNT arrays can ...
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WO/2008/079593A2 |
A method of using a minimal surface or a minimal skeleton to make a heat exchanger component is provided. The method comprises the steps of generating a stereolithography file from design data, slicing the stereolithography file into two...
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WO/2008/079679A2 |
In one embodiment, a method of making a heat exchanger is provided, comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, and depositing at least o...
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WO2007095044B1 |
An electrical circuit element on an electrical element package is cooled by structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with the electrical circuit element, and a rot...
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WO/2008/067434A2 |
An apparatus, system, and method for electronic cooling unit with unique features is disclosed. In representative embodiments and applications, the present invention generally provides improved methods and systems for cooling electronic ...
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WO/2008/060305A2 |
A cooling system has one or more fans disposed within a housing adapted to attach to a consumer electronics device. The cooling system can also include a switch, a male connector and a female connector adapted to interface with the consu...
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WO/2008/053090A1 |
The invention relates to a heat exchanger with an extruded body (3), comprising a tubular housing (4) with open ends (4.1, 4.2) and internal walls (5, 9) running parallel from one end of the housing to the other and defining open channel...
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WO/2008/053092A1 |
The invention relates to a heat exchanger, comprising a body (3) defining a central channel (7), surrounded by peripheral channels (10) and having ends provided with means for defining independent circuits arranged such that the central ...
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WO/2008/053093A1 |
The invention relates to a regulator valve (2) for a heat exchanger (1), comprising a valve body (21), provided with means (30) for mounting the same on the heat exchanger and a valve (26) movably mounted in the body facing a seat (25) f...
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WO/2008/051535A2 |
An apparatus enhances the efficiency of a combustion heating device such as a fireplace by incorporating an ionic gas propulsion mechanism (e.g., a corona discharge device) to transport ambient air through a heat exchanger. A heat exchan...
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WO/2008/047096A1 |
A heat exchanger is formed with tessellating conduits (4) passing therethrough. The tessellating conduits having transverse cross-sectional shapes which together substantially completely cover the transverse plane to the heat exchange (2...
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WO/2008/033882A2 |
A brazable composite metal material for a heat exchanger tube or manifold, a method of making the tube or manifold, and a heat exchanger made therefrom. The method of making the heat exchanger tube includes the steps of (a) providing a c...
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WO/2008/030745A2 |
In one embodiment, an apparatus includes a monolithically formed thermal conducting body that includes a passageway that extends from a first end to a second end of the body. At least one of the first end or the second end of the body is...
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WO/2008/018868A1 |
A mounting structure (34) for receiving a sensor (18) having a sensing portion (26) and a base portion (30) includes a substantially flat sheet of material (20) having a first surface (20a), a second surface (20b) opposite the first surf...
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WO/2007/046853A2 |
The present invention provides methods and systems for discretized, combinatorial processing (110) of regions of a substrate such as f the discovery, implementation, optimization, and qualification of new materials, processes, and proces...
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WO/2007/042514A1 |
A heater is described which operates on the principle of convection air currents within heating fins being established by heating of air adjacent to one or more heating elements and the transfer of heat from the convection currents to th...
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WO2006071631B1 |
Apparatus for cooling of an electrical element package, comprising in combination: structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the ...
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WO/2007/024229A1 |
A thermoelectric system (10) for pumping heat having at least one foam heat exchanger (45) is provided that enhances heat transfer awayfrom the system (10) to increase overall system efficiency and performance of the system.
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WO/2007/019558A2 |
A heat pipe comprising a chamber; a wick in the chamber, and a heat sink, which is adjacent to a first portion of the wick. A heat source adjacent to a second portion of the wick, wherein the wick is configured such that a gas condenses ...
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WO/2006/132695A2 |
A thermal material for heat dissipation, which includes at least one sheet (20) of flexible graphite sandwiched about a non-graphite core layer (30).
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WO/2006/101564A1 |
A bottle cooler system includes means for using atmospheric water condensate from the evaporator to draw heat from the condenser.
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WO/2006/081965A1 |
The invention relates to a heat exchanger which is composed of cylindrical block modules (1,1') which are made of graphite. All of the flow paths, for the product and for the service fluids, are located inside the block modules (1,1') wh...
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WO/2006/074353A2 |
An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to...
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WO2005100899B1 |
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...
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